Conductive Ink Composition for Localized Open-Circuit Repair
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Solution Overview
Problem
The existing methods for forming thin film transistors, such as LCVD, face challenges like high equipment costs, contamination, and poor electrical properties due to the requirement of high-power lasers and vacuum conditions.
Innovation Solution
A conductive ink composition is developed, comprising a first metal precursor solution and a photothermal material that absorbs light energy to generate heat, allowing for the reduction of the first metal ion and formation of a conductive coating film without expensive vacuum equipment or high-power lasers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photochemical reaction method is used for LCVD, then metal film can be deposited, but the surface must be heated to 200°C or above causing carbon contamination and poor electrical properties
Solution Approach 1:
The patent changes the reaction mechanism from photochemical to photothermal, allowing metal ion reduction at lower temperatures (below 200°C) by using photothermal material to convert light energy into heat locally, thus improving electrical properties while avoiding carbon contamination
Solution Approach 2:
The patent replaces the conventional photochemical reaction mechanism with a photothermal mechanism, where light energy is converted to thermal energy through photothermal material to reduce metal ions, thereby achieving better electrical properties without high-temperature heating
2Reliability
If photothermal method is used for LCVD, then high purity metal film can be produced, but high-power laser and high vacuum equipment are required making the process expensive
Solution Approach 1:
The patent extracts the high vacuum requirement from the process by using a liquid precursor solution that can be applied and reduced at atmospheric pressure, maintaining metal film purity while eliminating the need for expensive vacuum equipment
Solution Approach 2:
The patent uses a liquid precursor solution that can be applied directly and reduced in situ, replacing the need for complex vacuum deposition systems and high-power lasers, thereby significantly reducing equipment costs while maintaining process effectiveness
3Reliability
If conventional LCVD process is used, then thin film transistor wiring can be formed, but disconnection defects occur requiring expensive repair equipment
Solution Approach 1:
The patent applies the conductive ink composition containing metal ions and photothermal material to potential disconnection areas before final wiring formation, enabling in-situ repair of disconnections through localized laser irradiation without requiring external repair equipment
Solution Approach 2:
The patent incorporates repair functionality directly into the conductive ink composition itself, which contains both metal ions for conductivity and photothermal material for localized heating, allowing the wiring structure to self-repair disconnections through controlled laser irradiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive ink composition enables convenient and economic repair of pattern disconnections during electrode formation, achieving low electrical resistance and high conductivity while minimizing substrate damage.
Implementation Method 1
a photothermal material that absorbs light energy from outside and discharges as heat, to provide the heat for reducing the first metal ion to the first metal
Implementation Method 2
the first metal ion being reduced to a first metal
Data Source
AI summary
A conductive ink composition according to the present disclosure is a conductive ink composition that can be printed on a substrate, and this conductive ink composition includes a first metal precursor of which a first metal ion may be reduced to a first metal by heat, to form a conductive coating film on the substrate, and a photothermal material for absorbing light energy such as laser and discharges the heat to surroundings, to raise the surrounding temperature to a temperature not below the temperature at which the first metal ion may be reduced, and therefore the present disclosure enables to easily form a coating film that includes a conductive first metal regarding a disconnected point during a process of forming a fine pattern, thereby enabling efficient repair.