Low-Loss Copolymer-Silica Composition for Heat-Resistant Cured Insulators
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Solution Overview
Problem
Existing materials for high-frequency insulating applications lack excellent low dielectric properties and sufficient heat resistance, making them unsuitable for electronic substrates subjected to solder reflow processes.
Innovation Solution
A composition comprising an olefin-aromatic vinyl compound-aromatic polyene copolymer and surface-treated silica, with specific molecular weight and monomer content ranges, to achieve a cured product with low dielectric tangent and high storage elastic modulus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyolefins or aromatic vinyl compound polymers are used for low dielectric properties, then dielectric constant and dielectric tangent are reduced, but heat resistance deteriorates due to dependence on melting point or glass transition temperature
Solution Approach 1:
The patent applies parameter changes by controlling the number average molecular weight to be 500 or more and 100,000 or less, and adjusting the content of aromatic vinyl compound monomer units to 0-70 mass% and aromatic polyene units to specific ranges. These parameter optimizations enable the copolymer to achieve both low dielectric loss and improved heat resistance through molecular structure control rather than relying solely on melting point or glass transition temperature
Solution Approach 2:
The patent creates a composite material system by combining olefin-based polymer segments with aromatic vinyl compound and aromatic polyene segments in a copolymer structure. This composite approach at the molecular level allows the material to integrate the low dielectric properties of olefin polymers with the heat resistance characteristics of aromatic structures, achieving both objectives simultaneously
2Temperature
If fluorine-based resins are used for low dielectric constant and heat resistance, then dielectric properties and heat resistance are improved, but device suitability deteriorates due to difficulty in moldability and film formability
Solution Approach 1:
The patent changes the molecular weight parameter to a specific range (500-100,000) and adjusts the composition parameters of monomer units to achieve optimal balance between heat resistance and moldability. The copolymer's molecular structure, with controlled aromatic polyene content (1.5-20 pieces per number average molecular weight), provides thermal stability while maintaining processability for molding and film formation
Solution Approach 2:
The patent uses readily available olefin-based polymers and common aromatic monomers as starting materials, replacing expensive fluorine-based resins. The copolymerization process transforms these inexpensive, easily processable materials into a product that achieves heat resistance comparable to fluorine-based resins while retaining excellent moldability and film formability
3Ease of manufacture
If general graft polymerization is used for producing copolymer, then production is simplified, but graft efficiency and polymer uniformity deteriorate
Solution Approach 1:
The patent applies parameter changes by specifying the number average molecular weight range (500-100,000) and the compositional ratios of different monomer units precisely. These controlled parameters ensure uniform polymer structure and consistent graft efficiency while maintaining the simplicity of using commercially available polyethylene or polypropylene as base materials with standard styrene or divinylbenzene monomers
4Ease of operation
If thermoplastic resin is used for easy handling, then processability is improved, but heat resistance deteriorates making addition of heat-resistant resin required
Solution Approach 1:
The patent creates a composite polymer structure by incorporating aromatic vinyl compound units and aromatic polyene units into the olefin-based copolymer. This molecular-level composite gives the material thermoplastic processability from the olefin segments while the aromatic segments provide inherent heat resistance, eliminating the need to add separate heat-resistant resins
Solution Approach 2:
The patent changes the molecular weight parameter to 500-100,000 and controls the aromatic content parameters to achieve the optimal balance between thermoplasticity and heat resistance. The specific composition ranges allow the material to be processed like thermoplastics while maintaining sufficient thermal stability for high-frequency insulating applications
Data Source
AI summary
A composition comprises: a resin component including an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying all the following conditions (1) to (4): (1) a number average molecular weight of the copolymer is 500 or more and 100000 or less; (2) the aromatic vinyl compound monomer is an aromatic vinyl compound having 8 or more and 20 or less carbon atoms, and a content of a unit of the aromatic vinyl compound monomer is 0 mass% or more and 70 mass% or less; (3) the aromatic polyene is one or more selected from polyenes having 5 or more and 20 or less carbon atoms and having a plurality of vinyl groups and/or vinylene groups in the molecule, and a content of the vinyl groups and/or the vinylene groups derived from the unit of the aromatic polyene is 1.5 pieces or more and less than 20 pieces per number average molecular weight; and (4) the olefin is one or more selected from olefins having 2 or more and 20 or less carbon atoms, and a total of units of the olefin monomer, the aromatic vinyl compound monomer, and the aromatic polyene monomer is 100 mass%; and a surface-treated silica. The volume ratio between the resin component and the silica is in the range of 98 to 15 : 2 to 85. A cured product of the composition has a value of the dielectric tangent obtained by resonator method at a measurement frequency of 10 GHz and/or a measurement frequency range of 25 GHz to 40 GHz of 1.2×10-3 or less and a storage elastic modulus at 250°C in the range of 10 MPa or more and 10 GPa or less.