Adhesive Tape Expanding Device with Thermal Segmentation
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Solution Overview
Problem
Existing expanding devices for adhesive tapes with wafers face challenges in achieving uniform expansion due to temperature differences, leading to uneven space extension between components, which complicates accurate component pickup.
Innovation Solution
The expanding device incorporates a heating table, a non-heated ring with insulation, and a drive unit to control heat transfer, ensuring the adhesive tape is primarily heated in the wafer-attached region while minimizing heat conduction to peripheral areas, using a non-heated ring with a clearance and heat insulation to prevent temperature increase and promote isotropic expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the heating table is used to heat the adhesive tape for expansion, then the adhesive tape can be expanded, but heat is conducted to the shaft and lower expanding ring causing temperature differences that lead to non-uniform expansion
Solution Approach 1:
The expanding ring is divided into a heated upper expanding ring and a non-heated lower expanding ring. The heating table is designed to heat only the upper expanding ring and adhesive tape, while the lower expanding ring remains separate and non-heated. This segmentation prevents heat conduction to the shaft and lower ring, eliminating temperature differences that cause non-uniform expansion.
Solution Approach 2:
A holder is introduced as an intermediary component between the heated upper expanding ring and the non-heated lower expanding ring. The holder supports both rings during expansion but is designed to minimize heat conduction from the upper ring to the lower ring and shaft. This intermediary structure allows mechanical connection while preventing harmful heat transfer.
2Length of moving object
If the adhesive tape is expanded in the peripheral region contact with the upper expanding ring, then the tape expands outward, but the wafer-attached central region does not expand sufficiently
Solution Approach 1:
The heating table is designed with localized heating zones that apply heat preferentially to the central wafer-attached region of the adhesive tape and the upper expanding ring. The heating intensity and distribution are optimized to ensure the central region reaches the required expansion temperature first and maintains it, while the peripheral regions receive controlled heat. This local quality approach ensures uniform expansion across the entire tape, with the central region expanding sufficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more effective and uniform expansion of the adhesive tape in the wafer-attached region, ensuring even space extension between components and enabling high-accuracy component pickup.
Implementation Method 1
heat from the heating table 1002 is conducted to the shaft 1006, then the lower expanding ring 1005, and then the upper expanding ring 1004
Implementation Method 2
the heat insulation 5 is laid on an upper surface of the non-heated ring 12 to prevent the adhesive tape from receiving heat from the non-heated ring 12
Implementation Method 3
heat is applied not only to a region of the adhesive tape 1003 having the wafer attached thereto but also to a peripheral region thereof in contact with the upper expanding ring 1004. Therefore, the adhesive tape 1003 is expanded even in the region outward of the wafer-attached region
Data Source
AI summary
In an expanding device that can more effectively expand an adhesive tape in its wafer-attached region and can pick up components on the adhesive tape with high accuracy, a central first portion of an adhesive tape, including a portion with a wafer attached thereto, is laid on a top surface of a heating table, a non-heated ring is disposed to surround an outer peripheral edge of the heating table, a heat insulation is laid on an upper surface of the non-heated ring, a second portion of the adhesive tape located outwardly of the first portion thereof is located on or above the insulation, a third portion of the adhesive tape located outwardly of the second portion is held by a holder, and the holder is movable up and down relative to the heating table and the non-heated ring by a drive unit.