Reusable Adhesive Tape Component Picking via Segmented Support Peeling

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Solution Overview

Problem

Existing methods for picking electronic components from adhesive tapes often result in damage to the tape, making it non-reusable and increasing waste, while also requiring significant manual labor and resources.

Innovation Solution

A method and apparatus that involve displacing the adhesive tape towards a support bed to peel it from the edges of the electronic component, using a gripper to detach the component while minimizing damage to the tape, allowing for its reuse. This includes using a vacuum or gripper to displace the tape and a support structure to maintain the component's position during detachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a gripper clamps one end of the tape and peels it off the carrier, then the sensor can be detached from the tape, but the tape is damaged and cannot be reused

Engineering Contradiction:
Improvesensor detachmentVSAvoidtape reusability
Core Design Contradiction:
Ease of operationVSLoss of substance

Solution Approach 1:

The invention divides the tape into multiple sections by introducing support structures (pins or protrusions) that create discrete support points beneath the tape. This segmentation allows the tape to be peeled from between the support points without damaging the entire tape, enabling selective sensor removal while preserving the tape for reuse.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support structures act as intermediaries between the tape and the carrier. These supports create a gap that allows the tape to be displaced and peeled from the carrier surface without direct force being applied to the tape itself, thereby preventing tape damage while enabling sensor detachment.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If manual pick-up is used, then the sensor can be removed from the tape, but productivity is significantly reduced

Engineering Contradiction:
Improvesensor removalVSAvoidsensor processing speed
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The invention enables the tape carrier to essentially remove sensors itself through the support structures. The supports are positioned to allow automatic displacement and peeling of the tape from the carrier, eliminating the need for manual intervention and significantly improving processing speed while maintaining ease of operation.

Inventive Principle:
Principle #25Self-service

3Ease of operation

If the tape is peeled off the carrier, then the sensor can be accessed, but the tape carrier is destroyed and fresh tape is needed

Engineering Contradiction:
Improvesensor accessVSAvoidtape carrier reuse
Core Design Contradiction:
Ease of operationVSLoss of substance

Solution Approach 1:

By introducing multiple support points distributed across the tape, the invention segments the tape into multiple usable sections. This allows the tape to be peeled from between support points to access individual sensors, while the remaining tape sections stay intact and can be reused for subsequent sensors, eliminating the need for fresh tape carriers.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240359329A1Picking an electronic component from a reusable adhesive tape
Publication Date: 2024.10.31 ASMPT SINGAPORE PTE LTD
  • US20240359329A1 patent drawing
  • US20240359329A1 patent drawing
  • US20240359329A1 patent drawing

AI summary

A method of picking an electronic component from an adhesive tape on which the electronic component is mounted which includes selecting a electronic component from a plurality of electronic components arranged on the adhesive tape, each electronic component being located on the adhesive tape over an associated support upstanding from a support bed; displacing the adhesive tape towards the support bed to peel the adhesive tape from edges of the electronic component; and displacing a gripper to detach the electronic component from the adhesive tape.