Adhesive Tape Segmentation for Semiconductor Plating Protection
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Solution Overview
Problem
In the manufacturing of semiconductor devices, the plating process faces challenges in preventing the plating solution from contacting the metal layer, which can lead to dissipation of the metal layer and subsequent mounting failures due to the inability to effectively protect the metal layer from the plating solution, especially when using conventional adhesive tapes that may allow solution penetration through gaps.
Innovation Solution
The use of a first adhesive tape with a ring shape and a second adhesive tape, each with specific outer and inner diameters, is employed to protect the metal layer by attaching them to the substrate and metal layer through adhesive layers, ensuring the plating solution is prevented from contacting the metal layer during the electroless plating process, thereby forming a reliable plating layer without applying excessive tension that compromises sealability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective adhesive tape is attached to prevent plating solution contact, then metal layer protection is improved, but adhesive tape sealability deteriorates due to solution penetration through gaps
Solution Approach 1:
The protective adhesive tape is divided into multiple segments: a first adhesive tape with a hole and a second adhesive tape that covers the hole. This segmentation allows the first adhesive tape to provide baseline protection while the second adhesive tape seals the hole, preventing plating solution penetration through gaps and maintaining both metal layer protection and adhesive tape sealability
Solution Approach 2:
A resin layer is introduced as an intermediary substance filling the hole in the first adhesive tape. This resin layer acts as a mediator that prevents plating solution from penetrating through the hole while maintaining the structural integrity and sealability of the adhesive tape system, thereby protecting the metal layer without compromising tape sealability
2Reliability
If adhesive tape is used to protect metal layer, then metal layer dissipation is reduced, but excessive tension is applied compromising sealability
Solution Approach 1:
The protective function is segmented between two adhesive tapes: the first adhesive tape provides initial protection with reduced tension, while the second adhesive tape is specifically designed to cover the hole and provide sealing. This segmentation distributes the protective function to maintain both metal layer protection and adhesive tape sealability without excessive tension
Solution Approach 2:
The hole diameter in the first adhesive tape is carefully controlled to be larger than the metal layer diameter, creating a specific geometric parameter relationship. This parameter change allows the first adhesive tape to provide protection with reduced tension while the second adhesive tape compensates for the hole to maintain overall sealability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the plating solution from contacting the metal layer, reducing the risk of metal layer dissipation and ensuring high reliability of the semiconductor device by maintaining the integrity of the adhesive tapes' sealability, thus enhancing the manufacturing process and resulting device performance.
Implementation Method 1
a first adhesive layer; the first adhesive tape having the first adhesive layer provided on the first surface, the first adhesive tape being attached to the first substrate surface and the metal layer through the first adhesive layer
Implementation Method 2
In this plating process, a protective adhesive tape is attached to the part where a plating solution is not desired to be supplied
Data Source
AI summary
A semiconductor substrate according to an embodiment includes a substrate having a first substrate surface, the substrate having a first outer diameter; a metal layer provided on the first substrate surface, the metal layer having a second outer diameter smaller than the first outer diameter; a first adhesive tape having a ring shape, the ring shape having a third outer diameter smaller than the first outer diameter and larger than the second outer diameter, the ring shape having a third inner diameter smaller than the second outer diameter, the first adhesive tape having a first base material, the first base material having a first surface and a second surface opposed to the first surface, the first adhesive tape having a first adhesive layer provided on the first surface, the first adhesive tape being attached to the first substrate surface and the metal layer through the first adhesive layer; and a second adhesive tape having a fourth outer diameter smaller than the first outer diameter and larger than the third inner diameter, the second adhesive tape having a second base material having a third surface and a fourth surface opposed to the third surface, the second adhesive tape having a second adhesive layer provided on the third surface, the second adhesive tape being attached to the second surface and the metal layer through the second adhesive layer.