Adhesive Composition With Controlled Viscosity for Void-Free Lamination
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Solution Overview
Problem
When bonding substrates together while heating, existing adhesive compositions tend to form protrusions and voids, leading to contamination and poor bonding quality.
Innovation Solution
An adhesive composition with a complex viscosity of 10 Pa·s to 10,000 Pa·s at 25°C to 100°C and a viscosity reduction rate of 80% or less is applied, using a combination of curable and non-curable polyorganosiloxanes, along with a platinum group metal-based catalyst, to form a uniform adhesive layer without voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are bonded while heating to ensure bonding strength, then bonding strength is improved, but adhesive protrusion increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the viscosity characteristics of the adhesive composition across different temperatures. The adhesive is designed to maintain a viscosity reduction rate of 80% or less when heated from 25°C to 100°C, ensuring that the adhesive does not become too fluid during heating-based bonding processes. This controlled viscosity parameter prevents adhesive protrusion while still allowing effective bonding under heat.
2Ease of operation
If adhesive viscosity is reduced to improve applicability, then ease of application is improved, but adhesive protrusion increases
Solution Approach 1:
The patent utilizes parameter changes by designing an adhesive composition with specific viscosity characteristics at different temperatures. The adhesive maintains a complex viscosity of 10 to 10,000 Pa·s at 25°C for easy application, while its viscosity reduction rate when heated is controlled at 80% or less. This temperature-dependent viscosity parameter control enables both easy applicability and prevention of protrusion.
3Reliability
If adhesive composition is heated during bonding to ensure bond quality, then bonding quality is improved, but void formation increases
Solution Approach 1:
The patent applies parameter changes by controlling the viscosity reduction behavior of the adhesive under heating conditions. By limiting the viscosity reduction rate to 80% or less when heated from 25°C to 100°C, the adhesive maintains sufficient viscosity during the heating process. This prevents air from being trapped and forming voids, while still allowing the bonding process to benefit from heat activation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively suppresses protrusion and void formation, ensuring a uniform and strong bond between substrates, even under heating conditions, thereby improving bonding quality and reducing defects like air bubbles and contamination.
Implementation Method 1
the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1): Viscosity reduction rate (%)=((V25−V100)/V25)×100
Implementation Method 2
using a combination of curable and non-curable polyorganosiloxanes, along with a platinum group metal-based catalyst, to form a uniform adhesive layer without voids
Data Source
AI summary
An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa·s or more and 10,000 Pa·s or less at 25° C. or more and 100° C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):Viscosity reduction rate (%)=((V25−V100)/V25)×100 Formula (1)whereinV25: Complex viscosity at 25° C., andV100: Complex viscosity at 100° C.