Non-Macromolecular Adhesive Additives TRIZ Cases
- Composite Encapsulation Material for Uniform LED Phosphor Dispersion
Shear-thinning encapsulation material keeps phosphor uniformly suspended during LED dispensing, preserving lens shape and improving light extraction.
- Cable Wrapping Tape With VOC-Absorbing Adhesive Coating
Odor-control agents in the adhesive coating absorb VOCs in automotive cable wrapping tape while preserving adhesion, tearability, and durability.
- Curable Resin Composition for Fast Curing and Storage Stability
Specific ionic compounds suppress acid-triggered polymerization during storage while preserving rapid curing of 2-methylene-1,3-dicarbonyl resins.
- Auxetic Dicing Die-Attach Film for ESD-Safe Silicon Singulation
An auxetic DDAF with an ESD additive helps silicon bridge dies avoid static buildup, cracking, and peeling during singulation.
- Non-Conductive Film Structure to Prevent Epoxy Resin Migration
A layered non-conductive film blocks low molecular weight epoxy migration, preserving storage stability, peel strength, and void-free bonding.
- Photovoltaic Backboard Repair Tape for Weathering and Adhesion
Weather-resistant repair tape restores aging photovoltaic backboards with strong adhesion, insulation, UV resistance, and on-site repairability.
- Negative Electrode Secondary Particles for Low-Resistance Battery Cycling
Perfluoropolyether-bonded secondary particles absorb anode volume change, reducing resistance, cracking, and cycle degradation in batteries.
- Adhesive Composition With Controlled Viscosity for Void-Free Lamination
Controlled viscosity drop during heating suppresses adhesive protrusion and voids, helping laminates bond uniformly with less contamination.
- Core-Shell Die-Attach Material for Low-Voiding Electromigration Resistance
Core-shell particles use alloy-shell grain boundary segregation to cut voids and electromigration while keeping die-attach joints lead-free.
- Conductive Hot Melt Adhesive for Battery Thermal Discharge
A temperature-triggered conductive adhesive lets batteries discharge at high heat, reducing thermal runaway risk without extra components.
- Conductive Adhesive Film for Heat-Resistant Semiconductor Die Bonding
Organophosphorus-assisted metal particle bonding improves die-attach heat resistance, reflow reliability, and conductivity without lead.
- Composite Encapsulation Film for Removable Mini-LED Repair
A thermoplastic composite film bonds mini-LED modules securely yet peels off below 80°C without residue, enabling LED repair and replacement.