Adhesive Interlayer Wiring Board Connection for Impedance Matching
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Solution Overview
Problem
Existing multilayer wiring boards face challenges in efficiently connecting wiring boards with different numbers of conductive layers and thicknesses without using component mounting technologies like soldering, while maintaining connection reliability and design flexibility.
Innovation Solution
A method involving a first multilayer wiring board and a second multilayer wiring board with adhesive sheets positioned between them, where the boards are adhered through an adhesive layer, allowing pads on each board to face each other for electrical connection, enhancing connection reliability and design flexibility without the need for soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wiring boards with different numbers of conductive layers and thicknesses are connected without soldering, then manufacturing cost is reduced and design flexibility is enhanced, but connection reliability may deteriorate
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the first and second wiring boards. This adhesive layer not only bonds the boards together but also serves as a core structure for impedance matching, thereby maintaining connection reliability while eliminating the need for soldering processes
Solution Approach 2:
The adhesive layer is designed with specific dielectric properties (dielectric constant and thickness) that are carefully controlled to achieve impedance matching between the conductive layers of the two wiring boards. By adjusting these parameters, reliable electrical connections are maintained even without soldering
2Device complexity
If wiring boards with different numbers of conductive layers are connected without soldering, then manufacturing complexity is reduced, but impedance matching may deteriorate
Solution Approach 1:
The adhesive layer performs multiple functions simultaneously: it bonds the wiring boards together mechanically and provides impedance matching electrically. This multi-functionality simplifies the overall manufacturing process while maintaining precise impedance control
Solution Approach 2:
The dielectric properties of the adhesive layer (dielectric constant and thickness) are specifically engineered to compensate for impedance differences between wiring boards with different conductive layer configurations, achieving precise impedance matching without complex manufacturing processes
3Reliability
If adhesive layer is used to adhere wiring boards, then connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Positioning marks are provided on the wiring boards before assembly. These marks enable precise alignment of the pads with the adhesive layer and conductive layers during manufacturing, ensuring accurate positioning without requiring extremely tight tolerances
Solution Approach 2:
The adhesive layer serves as a compliant intermediary that can accommodate minor misalignments while maintaining reliable electrical connections. Its flexible nature allows it to bridge small positioning errors without compromising connection integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient connection of wiring boards with varying numbers of layers and thicknesses, improving connection reliability and design flexibility while reducing manufacturing costs and time, and achieving excellent impedance matching.
Implementation Method 1
an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board
Data Source
AI summary
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.