Adiathermic Cover Member for Semiconductor Test Board Thermal Isolation
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Solution Overview
Problem
Existing semiconductor test apparatuses face challenges in conducting temperature tests due to dew condensation issues during low-temperature tests, which affect electrical characteristics and require large or structurally modified components, increasing costs and limiting test apparatus specifications.
Innovation Solution
A performance board with adiathermic cover members is introduced, featuring a substrate with sockets for device mounting and a detachable cover member that thermally insulates the rear surface of the substrate, preventing dew condensation by directing dry air and maintaining thermal stability within the thermostatic chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large space is provided between the conversion board and sockets, then the temperature in the thermostatic chamber can be isolated from the test head, but the semiconductor test apparatus becomes limited in testable specifications
Solution Approach 1:
The invention transitions from horizontal spacing to vertical stacking, placing the conversion board above the sockets in the vertical dimension. This allows temperature isolation to be achieved through vertical separation rather than horizontal distance, maintaining compact footprint while enabling various test configurations.
Solution Approach 2:
The conversion board is positioned within the vertical space above the sockets, nesting components vertically rather than requiring horizontal separation. This nested arrangement achieves thermal isolation while preserving apparatus versatility for different device types.
2Reliability
If a sealed structure is provided under the thermostatic chamber, then dew condensation on the test head side is prevented, but the structure becomes dedicated to motherboard interfaces, limiting thermostatic chamber combinations
Solution Approach 1:
The performance board with vertically stacked conversion board and sockets serves multiple functions: it provides dew condensation prevention through vertical separation, maintains thermal isolation, and preserves adaptability for various thermostatic chamber combinations without requiring dedicated sealed structures.
Solution Approach 2:
Dew condensation prevention is achieved by vertical stacking of components rather than horizontal sealing structures. This dimensional change allows the same functionality to work with various thermostatic chamber configurations without structural modifications.
3Temperature
If a large space is provided between the test head and thermostatic chamber, then temperature isolation is achieved, but the apparatus size increases and specifications are limited
Solution Approach 1:
Temperature isolation is achieved by utilizing the vertical dimension for component stacking rather than requiring horizontal space. The conversion board and sockets are arranged vertically, providing thermal isolation without increasing the horizontal footprint of the apparatus.
Solution Approach 2:
Components are nested vertically within the apparatus footprint, with the conversion board positioned above the sockets. This nested arrangement achieves temperature isolation while maintaining a compact overall apparatus volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient temperature control and reduced dew condensation, enabling compact and cost-effective semiconductor test apparatus designs without the need for extensive structural modifications, thereby enhancing test accuracy and reducing costs.
Implementation Method 1
an adiathermic cover member which is attached to the rear surface of a region of the substrate on which the sockets are mounted
Implementation Method 2
preventing the dew condensation from forming have been provided
Data Source
AI summary
A performance board which is attached to a semiconductor test apparatus and on which devices under test are mounted is provided. The performance board includes: a substrate; sockets which are attached to the surface of the substrate and on which devices under test are mounted; and an adiathermic cover member attached to the rear surface of a region of the substrate on which the sockets are mounted.