Adjustable Air Baffle for Memory Thermal Management

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Solution Overview

Problem

Conventional air baffles for thermal management in computing systems are ineffective when not all DIMM slots are filled, leading to bypass airflow and reduced thermal efficiency, requiring the use of dummy DIMMs which increase costs and complexity.

Innovation Solution

An adjustable air baffle with venting units featuring adjustable venting plates that can pivot between open and closed positions, allowing airflow to filled DIMM slots while blocking airflow to empty slots, optimizing thermal performance without the need for dummy DIMMs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional fixed air baffles are used, then thermal management is effective when all DIMM slots are filled, but thermal efficiency deteriorates when DIMM slots are empty due to bypass airflow

Engineering Contradiction:
Improvethermal efficiencyVSAvoidadaptability to different DIMM configurations
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent applies the dynamics principle by making the air baffle adjustable rather than fixed. The air baffle includes multiple positions that can be configured to match different DIMM slot occupancy scenarios. This allows the thermal management system to adapt dynamically to varying system configurations, preventing bypass airflow whether slots are empty or filled, thereby maintaining optimal thermal efficiency across different operating conditions.

Inventive Principle:
Principle #15Dynamics

2Temperature

If dummy DIMMs are used to fill empty slots, then thermal efficiency is maintained, but device complexity and manufacturing costs increase

Engineering Contradiction:
Improvethermal efficiencyVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies the extraction principle by removing the need for dummy DIMMs entirely. Instead of adding extra components (dummy DIMMs) to solve the thermal management problem, the invention extracts the core function needed - an adjustable air baffle that can be configured to match actual DIMM slot occupancy. This eliminates unnecessary components, reduces system complexity, and lowers manufacturing costs while maintaining thermal efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If dummy DIMMs are used to fill empty slots, then thermal efficiency is maintained, but manufacturing costs increase

Engineering Contradiction:
Improvethermal efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent applies this principle by replacing expensive dummy DIMMs with a simpler, more cost-effective adjustable air baffle mechanism. The air baffle can be manufactured as a simple mechanical component with multiple positions, eliminating the need to produce and install additional DIMM modules. This significantly reduces manufacturing costs while achieving the same thermal management objective.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adjustable air baffle effectively directs airflow to installed memory components, enhancing thermal management and reducing manufacturing costs by eliminating the need for dummy DIMMs, while allowing for reconfiguration as system capacity changes.

Implementation Method 1

Each of the plurality of adjustable venting plates has an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings, and the respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Methodology Applied
Scientific EffectPivoting motion:

Data Source

PatentUS11252843B2Adjustable air baffle for system airflow improvement
Publication Date: 2022.02.15 QUANTA COMPUTER INC
  • US11252843B2 patent drawing
  • US11252843B2 patent drawing
  • US11252843B2 patent drawing

AI summary

An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.