Adjustable Aperture Control for Semiconductor Thickness Measurement
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Solution Overview
Problem
Existing semiconductor measuring devices struggle to accurately measure the thickness of different types of semiconductor elements without replacing components, particularly in the production of vertical-NAND (V-NAND), dynamic random access memory (DRAM), and logic circuits, as they require adjustments for varying thicknesses.
Innovation Solution
A semiconductor measuring device with a light source, aperture, and sensors, controlled by a controller, adjusts the gap between aperture parts to match the type of measurement target, using sensors to detect positions and calculate thickness based on polarization information, allowing for accurate measurements without component replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a fixed aperture structure is used, then the device structure is simple, but measurement precision for different thicknesses deteriorates
Solution Approach 1:
The aperture structure is made dynamic by enabling movement of the aperture plate or adjustment of the aperture gap width. The controller adjusts the aperture gap to different widths corresponding to different measurement target types (e.g., first gap for first type, second gap for second type), allowing the same device to accurately measure different thicknesses without component replacement.
2Measurement precision
If component replacement is required for different measurement targets, then measurement precision is maintained, but productivity deteriorates
Solution Approach 1:
The measuring device is designed with universal functionality to measure multiple types of measurement targets (different thicknesses) using a single aperture assembly. By adjusting the aperture gap width through the controller based on the measurement target type, the device eliminates the need to replace components for different measurement scenarios, thereby improving productivity while maintaining measurement precision.
3Adaptability or versatility
If aperture gap is adjusted for different target types, then adaptability improves, but device complexity increases
Solution Approach 1:
The controller receives information about the measurement target type and automatically adjusts the aperture gap width accordingly (first gap for first type, second gap for second type). This feedback mechanism enables the device to adapt to different measurement targets without requiring complex manual configuration, achieving high adaptability with manageable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device accurately measures the thickness of various semiconductor elements by dynamically adjusting the aperture gap based on target type, enhancing measurement precision and versatility without requiring component changes.
Implementation Method 1
reflected light reflected from the measurement target
Implementation Method 2
polarization information about the reflected light passing through the aperture
Data Source
AI summary
A semiconductor measuring device may include: a light source configured to output light with a specified wavelength toward a measurement target; an aperture on a light path along which reflected light reflected from the measurement target travels and comprising a first part and a second part that are spaced apart; at least one sensor configured to detect positions of the first part and the second part; and a controller electrically connected to the aperture and the at least one sensor, wherein the controller is configured to: determine a type of the measurement target based on type information; and control a position of at least one of the first part and the second part so that the first part and the second part have a gap that is a first gap corresponding to a first type based on the measurement target corresponding to the first type.