Adjustable Electrode in Continuous Plasma Processing
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Solution Overview
Problem
In plasma processing, particles generated during the process can attach to the carrier plate, causing electrical conductivity issues that affect the plasma process efficiency, lead to machine damage, and result in poor yield due to particle agglomeration and diffusion.
Innovation Solution
A continuous plasma processing system with an adjustable electrode is designed, featuring a frame-shaped carrier plate, loading, processing, and unloading chambers. The system includes a moving device that controls the second electrode to move between electrically disconnected and conducted positions, creating a non-plasma area between the carrier plate and the object being processed, thereby preventing electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the carrier plate is reused without cleaning, then the convenience of usage is improved, but particle contamination accumulates causing electrical conductivity issues that affect plasma process efficiency
Solution Approach 1:
The patent extracts the harmful particles from the carrier plate surface by introducing a blowing device that directs gas flow to remove particles. This allows the carrier plate to be reused without manual cleaning while maintaining plasma process efficiency by preventing particle accumulation that would cause electrical conductivity issues.
Solution Approach 2:
The system implements self-service by automatically removing particles from the carrier plate during or between processing cycles. The blowing device operates autonomously to maintain the carrier plate in a clean state, eliminating the need for external cleaning operations and enabling continuous reuse without contamination buildup.
2Productivity
If particles are allowed to accumulate on the carrier plate, then the convenience of continuous operation is improved, but electrical conductivity between the carrier plate and processed object increases causing machine damage
Solution Approach 1:
The blowing device extracts particles from the carrier plate surface before they can accumulate to dangerous levels. By continuously removing particles during operation, the system maintains electrical isolation between the carrier plate and processed objects, preventing short circuits while enabling continuous high-productivity operation.
Solution Approach 2:
The system applies preliminary anti-action by proactively removing particles before they can cause harmful electrical conductivity. The blowing device operates in advance to prevent particle accumulation, thereby preventing the potential for short circuits and machine damage before they can occur.
3Manufacturing precision
If the carrier plate is cleaned frequently to maintain plasma process efficiency, then the processing quality is improved, but the loss of time and productivity decreases
Solution Approach 1:
The blowing device enables continuous particle removal during the plasma processing operation itself, rather than requiring separate cleaning cycles. This maintains plasma process quality by preventing particle accumulation while eliminating downtime for cleaning operations, thereby preserving productivity and avoiding loss of time.
Solution Approach 2:
The system performs self-cleaning during normal operation through the blowing device, eliminating the need for external cleaning interventions. This maintains manufacturing precision by keeping the carrier plate free of particles while requiring no additional time investment, as the cleaning action is integrated into the continuous processing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively prevents the reduction of processing efficiency, machine damage, and poor yield by maintaining a non-conductive gap between the carrier plate and the object, ensuring focused plasma agglomeration and reducing contamination risks.
Implementation Method 1
particles generated by the plasma process are not only deposited on the surface of the to-be-processed object, but also attached to the surface of the carrier plate
Implementation Method 2
the moving device controls the second electrode to move between an electrically disconnected position and an electrically conducted position
Data Source
AI summary
A continuous plasma processing system with adjustable electrode includes a frame shape carrier plate for holding a to-be-processed object, a loading chamber for inputting the to-be-processed object, a processing chamber, and an unloading chamber for outputting the finished object. The processing chamber has a first electrode, a second electrode, and a moving device controlling the second electrode to move between an electrically disconnected position and an electrically conducted position. When the second electrode is away from the first electrode and does not contact the to-be-processed object, the second electrode is at the electrically disconnected position. When the second electrode moves toward the first electrode to push the to-be-processed object to leave the frame shape carrier plate, the second electrode is at the electrically conducted position. The plasma electric field is prevented from being affected by particles on the carrier plate.