Adjustable Heat Pipe Positioning in Thermal Management
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Solution Overview
Problem
Existing heat dissipation systems face inefficiencies due to varying heights of electronic components on a substrate, leading to increased heat resistance caused by gaps between components and heat receiving members, especially when heat transfer sheets are thick and heat pipes are not adjustable.
Innovation Solution
A heat dissipation system with heat receiving members and heat pipes that are vertically movable within adjustable openings in the heat sink, allowing for uniform positioning and reduced heat resistance by using spring plates or bushings for efficient heat transfer, accommodating varying component heights and minimizing stress on components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat pipes are fixed at a certain height relative to the heat sink, then the heat dissipation structure is simple and stable, but large gaps occur between electronic components and heat receiving members, increasing heat resistance
Solution Approach 1:
The heat pipe is designed with vertical movability within the opening of the heat sink, transforming from a fixed structure to a dynamic adjustable structure. This allows the heat pipe to adapt to varying heights of electronic components, reducing gaps and improving heat transfer efficiency without requiring complex external adjustment mechanisms
Solution Approach 2:
The position parameter of the heat pipe is made changeable within the opening range, allowing vertical adjustment to match different component heights. This parameter flexibility enables optimal heat contact while maintaining structural simplicity through the inherent design of the opening
2Adaptability or versatility
If heat transfer sheets are used to fill gaps between electronic components and heat receiving members, then component positioning flexibility is improved, but heat resistance increases due to thick heat transfer sheets
Solution Approach 1:
Instead of using static heat transfer sheets to accommodate height variations, the invention implements dynamic vertical adjustment of the heat pipe itself. This eliminates the need for thick heat transfer sheets by directly positioning the heat pipe at the appropriate height, thereby maintaining low heat resistance while achieving positioning flexibility
Solution Approach 2:
The invention extracts the height adjustment function from the heat transfer sheet layer and transfers it to the heat pipe positioning mechanism. By removing the compensatory role of thick heat transfer sheets and implementing direct vertical adjustment, heat transfer efficiency is improved while maintaining adaptability
3Stability of the object's composition
If heat pipes are pressed into fixed positions by spring members or flanges, then heat pipe positioning is secure, but stress is applied to electronic components with varying heights
Solution Approach 1:
The heat pipe is designed to move vertically within the opening without requiring external pressing mechanisms like spring members or flanges. This dynamic positioning within the opening eliminates the need for pressing forces that would transmit stress to electronic components, while maintaining stable positioning through the opening constraints
Solution Approach 2:
The invention removes the pressing and fixing mechanisms (spring members, flanges) that cause stress on components. Instead, stability is achieved through the geometric constraints of the opening and the heat pipe's ability to maintain position within that opening without external forcing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces heat resistance and minimizes stress on components by allowing adjustable positioning of heat pipes and heat receiving members, ensuring efficient heat transfer and maintaining component stability across varying electronic component heights.
Implementation Method 1
a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate
Implementation Method 2
the heat pipe is pressed into the insertion groove of the fin by a spring member
Data Source
AI summary
A heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate.