Adjustable Height Liquid Cooler for High Heat Dissipation
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Solution Overview
Problem
Existing cooling technologies for electronic devices are inadequate for high heat loads, as monolithic liquid flow through plates can only effectively manage moderate heat loads of up to 50 Watts, failing to provide extensive cooling for higher power dissipation needs.
Innovation Solution
A cooling apparatus comprising a circuit board with heat-generating electronic devices, a cooling device thermally connected to each device, and a coolant plate with flexible conduits allowing pressurized coolant fluid transfer between the cooling device and the coolant plate, enabling efficient heat absorption and dissipation through microchannel or minichannel structures, with an adjustment mechanism to optimize thermal connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a monolithic liquid flow through plate is used for cooling, then the cooling apparatus can be manufactured as a single integrated component, but the cooling capacity is limited to moderate heat loads of up to 50 Watts
Solution Approach 1:
The cooling apparatus is divided into multiple separate components: a coolant plate with internal passages and multiple independent cooling devices with microchannels. This segmentation allows each component to be optimized independently and assembled to handle higher heat loads (480-600 Watts) while maintaining manufacturing feasibility through standardized parts.
Solution Approach 2:
The cooling devices are positioned within or adjacent to the coolant plate, with the microchannel cooling devices nested in relation to the larger coolant plate structure. This nested arrangement allows the system to achieve high cooling capacity by combining the heat dissipation area of the plate with the high-efficiency microchannel cooling devices.
2Device complexity
If the cooling device height is fixed, then the apparatus structure is simplified, but the thermal contact with electronic devices of varying heights cannot be optimized
Solution Approach 1:
The cooling devices are made adjustable in height relative to the coolant plate through adjustment mechanisms. This dynamic adjustability allows optimization of thermal contact with electronic devices of varying heights while maintaining a relatively simple overall structure. The adjustment capability ensures reliable thermal contact without requiring complex fixed-positioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates higher heat loads, up to 480-600 Watts with multiple cooling devices, compared to the 40-50 Watts managed by monolithic liquid flow through plates, providing enhanced cooling capabilities for high-power electronic devices.
Implementation Method 1
The cooling device is adapted to absorb heat from the one of the plurality of electronic devices and transfer that heat to the coolant fluid
Implementation Method 2
the coolant plate is adapted to absorb heat from the remainder of the plurality of electronic devices and transfer that heat to the coolant fluid
Implementation Method 3
a source of pressurized coolant fluid is connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device
Data Source
AI summary
An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.