A rotary-drum sensor, guide part, and worm-gear drive retract or expose only the needed POLED area to save dashboard space and power.
Slide-on stiffeners, graphene heat paths, shaped fusible elements, and shield void control reduce PCB bowing, solder stress, and EMI.
Slide-on stiffeners, graphene heat paths, and shield voids help connectors and PCBs limit warping, thermal stress, and EMI.
Anti-invar alloy stiffeners balance die-substrate thermal mismatch to reduce IC package warpage and support larger die-to-package ratios.