Angled Card Cage Layout for Wide PCB Fit and Thermal Dissipation

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Solution Overview

Problem

Existing electronics enclosures are limited to accommodating CCA modules of specific standardized sizes, leading to the need for multiple enclosures when mixed sizes are required, and sealed enclosures complicate heat dissipation.

Innovation Solution

A card cage design with slide rails aligned at an angle greater than 20 degrees to the enclosure sides, allowing for wider PCB modules and enabling narrower enclosure designs or enhanced cooling through angled placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If slide rails are aligned perpendicular to enclosure sides (standard design), then structural simplicity and ease of manufacture are improved, but the ability to accommodate diverse CCA module sizes and optimize thermal management deteriorates

Engineering Contradiction:

Improveease of manufactureVSAvoidadaptability

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies asymmetry by angling the slide rails at a specific angle (e.g., 30 degrees) relative to the enclosure sides, breaking the conventional perpendicular alignment. This asymmetric configuration enables the enclosure to accommodate CCA modules with span dimensions that exceed the enclosure width, while still maintaining manufacturability through standardized angular relationships.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent utilizes dimensionality change by projecting the slide rails at an angle rather than aligning them perpendicular to the enclosure faces. This angular projection allows the CCA modules to be inserted at an angle, effectively utilizing diagonal space within the enclosure and accommodating modules whose span dimension exceeds the enclosure width in the perpendicular direction.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If sealed enclosures are used to protect against harsh environments, then protection against contaminants is improved, but heat dissipation capability deteriorates

Engineering Contradiction:

Improveprotection against contaminantsVSAvoidheat dissipation

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent introduces thermal interface materials or heat sinks as intermediary elements between the CCA modules and the enclosure structure. These intermediaries facilitate heat transfer from the powered CCA modules to the enclosure walls, enabling effective thermal management even when the enclosure is sealed to protect against harsh environments.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If enclosure width is reduced to minimize footprint, then space efficiency is improved, but the ability to accommodate wide CCA modules deteriorates

Engineering Contradiction:

Improveenclosure footprintVSAvoidaccommodation of wide modules

Core Design Contradiction:

Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent applies dimensionality change by utilizing diagonal insertion paths through angled slide rails. This allows CCA modules with large span dimensions to be accommodated within enclosures having smaller width dimensions, as the modules are inserted at an angle rather than perpendicular to the enclosure faces, effectively using three-dimensional space more efficiently.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The asymmetric angular configuration of the slide rails enables the enclosure to accommodate modules that would otherwise require a larger perpendicular width. By projecting the insertion path at an angle, the effective accommodating dimension becomes the diagonal projection rather than the perpendicular width, allowing compact enclosure footprints.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates accommodation of diverse CCA module sizes within a single enclosure and improves heat dissipation by allowing for angled PCB placement, optimizing space and cooling efficiency.

Implementation Method 1

improves heat dissipation by allowing for angled PCB placement

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

sides of the electronics enclosures are often open or filled with apertures so that ambient air can freely move through the electronics enclosures housing the CCA modules, thereby convectively cooling the PCBs

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260032843A1Chassis design for improved fit and thermal management

Publication Date: 2026.01.29 HAMILTON SUNDSTRAND CORP

AI summary

Apparatus and associated methods relate to providing space within an electronics enclosure of a predetermined width for Printed Circuit Board (PCB) modules having span dimensions greater than the width of the electronics enclosure. Such PCB modules are received by an electronics card cage configured having first and second pluralities of slide rails. The first and second pluralities of slide rails are located between and aligned with one another along parallel first and second alignment planes, respectively. Each of the first plurality of slide rails is aligned with a corresponding one of the second plurality of slide rails, thereby defining a card slot spanning a span dimension therebetween. The span dimension is directed along an axis intercepting each of the first and second alignment planes at an angle of incidence that is greater than 20 degrees from normal vectors thereto.