Electronic Card Support Core for 6U Chassis Thermal and Mechanical Stability

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Solution Overview

Problem

Existing electronic card assemblies in 3U or 6U formats are fragile and often poorly cooled, lacking sufficient mechanical robustness and thermal management.

Innovation Solution

A support device with a thermally conductive core that holds electronic cards in separate planes, using bearing faces and fixing edges for enhanced mechanical stability and thermally conductive materials to dissipate heat, while allowing for modular configuration and improved cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic cards are fixed one above the other in a mechanical adapter, then the assembly can be inserted into a 6U format chassis, but the assembly becomes relatively fragile and the electronic cards are not well cooled

Engineering Contradiction:
Improvecompatibility with 6U format chassisVSAvoidmechanical robustness
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The support device divides the electronic card assembly into separate planes by positioning each card in its own plane rather than stacking them directly. This segmentation provides individual support for each card while maintaining overall structural integrity and compatibility with 6U format chassis.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a vertical stacking arrangement to a multi-planar configuration where electronic cards are held in separate planes. This dimensional change allows each card to have its own support plane while maintaining compact overall dimensions suitable for 6U format chassis.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If electronic cards are fixed one above the other in a mechanical adapter, then the assembly can be inserted into a 6U format chassis, but the electronic cards are not well cooled despite the presence of the radiator

Engineering Contradiction:
Improvecompatibility with 6U format chassisVSAvoidcooling efficiency
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The support device provides separate planes for each electronic card, allowing independent thermal management for each card. This segmentation enables more effective heat dissipation paths and improves cooling efficiency while maintaining compatibility with 6U format chassis.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support device acts as an intermediary thermal management component between the electronic cards and the cooling system. It provides dedicated thermal contact surfaces that facilitate more efficient heat transfer from each card to the cooling infrastructure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If a mechanical adapter with radiator is used to hold two electronic cards, then thermal energy can be dissipated, but the assembly remains relatively fragile

Engineering Contradiction:
Improvethermal energy dissipationVSAvoidmechanical robustness
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The support device segments the mechanical support function from the thermal management function, providing dedicated structural support elements that enhance mechanical robustness while maintaining effective thermal dissipation pathways for each electronic card.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support device utilizes composite construction combining mechanically robust materials for structural support with thermally conductive materials for heat dissipation. This composite approach simultaneously improves mechanical robustness and thermal management performance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a robust and efficiently cooled electronic card assembly by enhancing mechanical stability and thermal management, reducing costs through shared thermal components and enabling modular expansion.

Implementation Method 1

When the core is also made of a thermally conductive material, the support device then makes it possible to improve the cooling of the electronic cards during their operation, by conveying, by conduction towards the chassis, the thermal energy dissipated by the electronic cards.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3206469B1Device for supporting at least two electronic cards, associated electronic module and electronic system
Publication Date: 2019.01.09 ALSTOM TRANSPORT TECH SAS
  • EP3206469B1 patent drawingFigure 1~2
  • EP3206469B1 patent drawingFigure 3~4
  • EP3206469B1 patent drawingFigure 5~7

AI summary

This support device (24) for at least two electronic cards (22) is intended to be inserted into a chassis, each electronic card (22) having two faces (26, 28) and a peripheral edge (30). The support device (24) includes a core (40) configured to be arranged between the electronic cards (22) and to hold the electronic cards (22) in separate planes, with one face (26, 28) of one electronic card (22) positioned opposite a corresponding face (26, 28) of another electronic card (22).