Sliding Liquid Cooling Plate Assembly for Test Board Heat Dissipation
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Solution Overview
Problem
Existing testing devices for semiconductor components face challenges in heat dissipation, particularly for high-efficiency circuit boards, as air cooling is inadequate and liquid cooling modules pose issues with space arrangement and assembly complexity.
Innovation Solution
A liquid cooling testing device with a slide rail component and a liquid cooling plate that allows for the circulation of cooling liquid, enhancing heat dissipation efficiency by sliding and locking mechanisms, and incorporating a flow detection module for monitoring liquid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling is used for heat dissipation, then the structure is simple, but the cooling efficiency is insufficient for high-efficiency testing circuit boards
Solution Approach 1:
The patent applies liquid cooling technology by introducing a liquid cooling plate with channels through which cooling liquid flows. This hydraulic approach replaces the insufficient air cooling system, enabling effective heat dissipation for high-efficiency testing circuit boards while maintaining reasonable structural complexity
2Temperature
If liquid cooling modules are adopted, then the cooling efficiency is improved, but space arrangement and assembly complexity become problematic
Solution Approach 1:
The liquid cooling plate is designed with a sliding structure that can move along guide rails between a working position and a loading position. This dynamic design allows for easy assembly and disassembly, reducing assembly complexity while maintaining effective liquid cooling functionality during operation
Solution Approach 2:
The cooling system is segmented into a separate liquid cooling plate that can be independently assembled and removed. This modular segmentation simplifies the overall assembly process and allows for easier maintenance and replacement without affecting the entire testing device
3Ease of operation
If liquid cooling plate is made movable for easy assembly, then the ease of operation is improved, but the liquid flow connection reliability may be compromised
Solution Approach 1:
The liquid cooling plate is pre-equipped with inlet and outlet channels that align with corresponding coupling members on the guide rails. This preliminary configuration ensures that when the plate is slid into the working position, the liquid flow connections are automatically established with high reliability, maintaining both ease of operation and connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents overheating of testing circuit boards, ensuring stable and high-efficiency testing operations by optimizing heat dissipation and providing real-time monitoring of cooling liquid flow.
Implementation Method 1
Through the circulation of the cooling liquid in the liquid cooling plate, the testing circuit board can be cooled
Implementation Method 2
The cooling liquid supplying module supplies a cooling liquid to the channel of the liquid cooling plate through the liquid-input coupling member and recycles the cooling liquid from the channel of the liquid cooling plate through the liquid-output coupling member
Data Source
AI summary
A liquid cooling testing device includes a body, a sliding assembly, a liquid cooling plate, a test circuit board, a liquid-input coupling, a liquid-output coupling, and a cooling liquid supply module. The sliding assembly is disposed on the body. The liquid cooling plate includes a liquid inlet, a channel and a liquid outlet sequentially in communication with each other. The test circuit board is fixed on the liquid cooling plate. The cooling liquid supply module is in communication with the liquid-input coupling and the liquid-output coupling. The cooling liquid supply module supplies a cooling liquid to the channel of the liquid cooling plate through the liquid-input coupling member, and the cooling liquid supply module recycles the cooling liquid from the channel of the liquid cooling plate through the liquid-output coupling member.