Adjustable Inductor Circuit for Pad-to-I/O Signal Integrity
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Solution Overview
Problem
Semiconductor devices face challenges in maintaining signal integrity due to parasitic components between input/output circuits and pads, leading to deteriorated eye margin and signal integrity issues.
Innovation Solution
Incorporating an inductor circuit with an adjustable inductance between pads and input/output circuits, featuring an inductor pattern and a variable pattern that can be floated or connected to a ground power voltage to adjust total inductance, thereby compensating for parasitic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inductor circuit is added between pads and input/output circuits, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The patent changes the inductance parameter by providing multiple inductor patterns with different inductance values and selectively connecting them through variable patterns. This allows the inductance to be adjusted according to specific signal integrity requirements without adding unnecessary circuit complexity for all applications.
Solution Approach 2:
The patent introduces variable patterns that can dynamically change the connection state between different inductor patterns, enabling the inductance value to be adjusted based on operating conditions. This dynamic adjustment optimizes signal integrity while avoiding fixed complex circuitry for all scenarios.
2Adaptability or versatility
If multiple inductor patterns with different inductance values are provided, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent segments the inductor circuit into multiple discrete inductor patterns with different inductance values, each optimized for specific conditions. These segmented inductor patterns are connected through variable patterns, allowing selective activation based on requirements, thus providing adaptability without requiring all patterns to be simultaneously complex.
3Manufacturing precision
If the inductor pattern is separated into multiple segments, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The inductor pattern is divided into multiple separate inductor patterns with different inductance values, which can be fabricated using standard manufacturing processes. Each segmented pattern is simpler to manufacture with precise control over inductance values, and they are connected through variable patterns to form the complete adjustable inductor circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances signal integrity by increasing the valid period and swing level of signals, improving the eye margin and reducing the impact of parasitic components.
Implementation Method 1
an inductor circuit connected between at least one of the plurality of pads and at least one of the plurality of input/output circuits. The inductor circuit includes an inductor pattern connected between the at least one of the plurality of pads and the at least one of the plurality of input/output circuits
Implementation Method 2
a variable pattern disposed between at least portions of the inductor pattern. The variable pattern is separated from the inductor pattern, the at least one of the plurality of pads, and the at least one of the plurality of input/output circuits
Data Source
AI summary
A semiconductor device includes a plurality of pads connected to an external device, a memory cell array in which a plurality of memory cells are disposed, a logic circuit configured to control the memory cell array and including a plurality of input/output circuits connected to the plurality of pads, and at least one inductor circuit connected between at least one of the plurality of pads and at least one of the plurality of input/output circuits. The inductor circuit includes an inductor pattern connected between the at least one of the plurality of pads and the at least one of the plurality of input/output circuits, and a variable pattern disposed between at least portions of the inductor pattern. The variable pattern is separated from the inductor pattern, the at least one of the plurality of pads, and the at least one of the plurality of input/output circuits.