Printed Electric Component Incorporation TRIZ Cases

See how printing electronic components directly onto furniture coating eliminates special reces

Interchangeable overlays and programmable controls let one brewing panel fit multiple machine configurations while cutting panel variants and inventory.

Separating the antenna carrier from the heat-removal carrier improves thermal conduction, cuts signal loss, and supports dense high-frequency packaging.

A porous support and PVA-coated resin layer absorb ink solvent to suppress blurring with water-based and solvent-based inks.

A stepped lid-mounted busbar replaces thick cables, enabling reliable cell-pack terminal connection with easier battery assembly.

Integrated lid busbars replace folded thick cables, simplifying cell-pack terminal connection and battery assembly after lid placement.

A rigid-flex sensing assembly with a fuse-integrated leg cuts battery module weight, simplifies assembly, and resists damage from force.

Cutaway regions in a monolithic magnetic core reduce coupling between conductive paths, enabling smaller and more efficient power circuits.

An adjustable inductor between pads and I/O circuits compensates parasitics to improve eye margin, valid period, and signal swing.

Inductive patterns near the wiring board edge stabilize ground voltage, cutting return loss and attenuation in high-frequency transmission.

Vertical stacking of capacitor and inductor layers with via conductors shortens current paths and cuts parasitic resistance and inductance.

A high-heat-capacity, higher-density protection layer limits temperature rise during fuse blowout and prevents conductive carbide re-bridging.

Vertically oriented terminal leads and winding grooves spread current more evenly in planar transformers, cutting high-frequency termination loss.

Injection-molded sealing embeds circuits, display, and touch functions while lead-out terminals replace bending cables for lighter, tougher electronics.

An adjacent nanoplasma DC switch biases an RF switch without blocking capacitors, chokes, or baluns, cutting circuit area and cost.

Injection-molded sealing embeds the circuit and lead-out terminal into one thin structure, improving moisture, weather, and impact resistance.

A hollowed PCB layout keeps the phase shifter trace supported while cutting insertion loss and preventing resistor mounting deformation.

A third electrode attracts plasma-induced airflow toward electronic components, reducing diffusion in the shield case and improving cooling.

Hollowed PCB regions near the trace cut base-material interference, lowering insertion loss while frame support keeps the phase shifter stable.

Adjacent same-plane coils raise inductance in a thin embedded substrate while avoiding higher resistance, power loss, and magnetic saturation.

Laser-formed through-holes let winding segments pass through the magnetic layer, simplifying manufacture and shrinking magnetic circuit components.

Asymmetric coil wire end surfaces reduce magnetic flux hindrance, enabling smaller inductors to retain coil characteristics.

Selective insulation thinning at coil end surfaces shortens axial length while preserving turn-to-turn insulation and coil performance.

Opposed spiral coils with asymmetric wiring widths cut undulation and resistance while raising space factor and motor torque.

A single-resin coil module integrates the coil and mounted elements to improve handling, keep alignment accurate, and suppress thermal warpage.

A staggered through-conductor layout forms a helical coil on glass, raising inductance and Q without enlarging the substrate.

Dual-surface spiral coil wiring and a through-hole conductor improve solderability, levelness, and substrate joint reliability.

Protruding conductive pads enable electroless plating on embedded component carriers, improving adhesion, mechanical stability, and electrical reliability.

By placing both connection lands on one board and splitting spiral coils across both surfaces, this case cuts coil device thickness while preserving Lorentz force.

Stacked open-ring inductors and dielectric-linked vias shrink RF passive layouts while improving parasitic consistency and chip matching.

A thicker first electrode spanning above and below a second electrode keeps stray capacitance stable despite substrate undulation.

A switched extended-ground antenna shifts resonance frequency to support multi-band wireless communication in limited device space.

Staggered lead rows on protruding COF films raise driver terminal density for high-resolution displays without enlarging film area.

Opposed cut-wire arrays on a thin dielectric film raise terahertz refractive index and directivity while keeping the lens planar.

Integrated PCB edge teeth replace separate gears to deliver compact angle sensing with high angular resolution and fewer components.

A PCB with integrated circumferential gear toothing cuts parts and installation space while enabling precise steering angle measurement.

Layered electrochemical sensor fabrication enables real-time sweat biomarker tracking and wireless hydration insights during physical activity.

Matched-expansion adhesive bonding replaces solder reflow to keep superconductive multi-chip contacts stable through thermal cycling and vibration.

Backside bias voltage plates and through plugs free lateral wiring space while delivering reliable well bias in dense 3D semiconductor stacks.

A deformable selector links one NFC chip at a time to a single antenna, improving security, passive power use, and interference control.

A third electrode attracts induced plasma airflow toward electronic components, limiting shield-case diffusion and improving heat dissipation.

PEDOT:PSS and reduced graphene oxide form a flexible textile sensing layer for durable, reproducible skin-temperature readings.