Glass-Substrate Helical Inductor Layout for Higher Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inductor components face challenges in increasing inductance value and Q value without expanding the substrate size, as increasing the number of coil turns or conductor diameters leads to contact issues between conductors.
Innovation Solution
The inductor component employs a glass substrate with a helically wound coil featuring staggered first and second through conductors and alternately long and short coil conductors, allowing for increased turns and diameters without substrate size expansion by arranging conductors in a zigzag pattern to avoid contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of turns of the coil is increased to increase the inductance value, then the inductance value is improved, but the size of the substrate is increased
Solution Approach 1:
The patent transitions from a planar coil configuration to a three-dimensional helical structure by introducing through conductors that penetrate the substrate. This vertical dimension allows the coil to achieve more turns within the same substrate footprint, increasing inductance without expanding the substrate area. The helical shape formed by connecting bottom surface conductors, top surface conductors, and through conductors creates a spatial arrangement that maximizes turns density.
Solution Approach 2:
The patent embeds the through conductors within the substrate, nesting the coil structure inside the substrate volume rather than spreading it out on the surface. The bottom surface conductors, top surface conductors, and through conductors are integrated into a compact nested arrangement where the coil path winds through the substrate thickness, achieving higher inductance in a smaller footprint.
Data Source
AI summary
An inductor component comprises, a glass substrate including first and second main surfaces opposed to each other, and a coil on the glass substrate. The coil is wound in a helical shape along an axis, and includes first coil conductors arranged along the axis on the first main surface of the glass substrate, second coil conductors arranged along the axis on the second main surface of the glass substrate, first through conductors arranged in a staggered manner along the axis and penetrating the glass substrate from the first main surface toward the second main surface, and second through conductors arranged in a staggered manner along the axis and penetrating the glass substrate from the first main surface toward the second main surface. The second through conductors are arranged along the axis and are on an opposite side from the first through conductors with respect to the axis.


