Integrated Coil Module Structure for Accurate Positioning and Low Warpage
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Solution Overview
Problem
Existing coil modules for actuators in camera systems face challenges in component handling and accuracy, and are susceptible to warpage due to differences in thermal expansion coefficients of resin materials used.
Innovation Solution
A coil module with a conductor layer including a wiring portion and a helical-shaped coil portion, integrated with a single type of sealing resin that covers the components, enhancing handling and positional accuracy while minimizing warpage through uniform thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If separately mounting a planar coil and an IC chip on a flexible substrate, then component handling is improved, but positioning accuracy between the coil and IC chip deteriorates
Solution Approach 1:
The patent combines the planar coil and IC chip into a single integrated module structure, where the coil is directly mounted on the IC chip substrate rather than separately mounting both components on a flexible substrate. This integration maintains ease of handling while achieving high positioning accuracy between the coil and IC chip.
2Adaptability or versatility
If using multiple types of resin materials in the coil module, then functional requirements are met, but warpage susceptibility increases due to different thermal expansion coefficients
Solution Approach 1:
The patent uses a single type of resin material (epoxy resin) for both the insulating layer and sealing resin throughout the coil module structure. This homogeneous material selection ensures uniform thermal expansion characteristics, preventing warpage while still meeting all functional requirements for insulation and protection.
3Reliability
If providing an inner insulating layer made of flexible film inside the insulating layer, then insulation performance is improved, but the number of resin material types increases leading to warpage
Solution Approach 1:
The patent eliminates the inner insulating layer made of flexible film and instead uses the epoxy resin insulating layer throughout, maintaining consistent material composition. This single-material approach provides sufficient insulation performance while avoiding the warpage issues caused by multiple resin types with different thermal expansion coefficients.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves component handling and maintains high positional accuracy, and suppresses warpage caused by temperature changes, ensuring reliable operation of the coil module in actuator applications.
Implementation Method 1
the sealing resin is integrally formed of a single type of resin material and has a predetermined thickness in a first direction perpendicular to the plane... because the sealing resin is integrally formed using a single type of resin material, warpage caused by temperature change can be suppressed
Data Source
AI summary
A coil module includes a conductor layer, at least one element, and a sealing resin. The conductor layer is formed along a predetermined plane and includes a wiring portion and a helical-shaped coil portion. The at least one element is mounted on the wiring portion. The sealing resin covers the conductor layer and the at least one element. The sealing resin is integrally formed of a single type of resin material and has a predetermined thickness in a first direction perpendicular to the plane.