Planar Dual-Coil Inductor Layout for High Inductance in Thin Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inductor components face challenges in achieving high inductance values while being miniaturized, as increasing the number of stacked wiring patterns to achieve high inductance leads to increased resistance and power loss, and reducing the thickness of magnetic layers results in decreased inductance due to magnetism saturation.
Innovation Solution
The inductor component design includes two coils disposed on the same plane with orthogonal axes, connected by a conductor, where the shortest distance between them is optimized to be greater than the largest wiring width but less than the average diameter of their enclosing circles, allowing for improved inductance without increasing resistance or reducing magnetic layer thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of stacked wiring patterns is increased to obtain a high inductance value, then the inductance value is improved, but the thickness of the inductor component increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (multiple layers in the thickness direction) to a planar arrangement (multiple coils in the same plane). Specifically, multiple coils are disposed adjacently in the same plane with their axes parallel to each other, allowing the inductor to achieve high inductance through lateral expansion rather than vertical stacking, thereby reducing the overall thickness of the component.
2Length of moving object
If the thickness of the wiring pattern is reduced to increase the number of stacked wiring patterns, then the inductor component can be thinned, but the resistance value of the wiring pattern increases and power loss increases
Solution Approach 1:
The patent eliminates the need for thin wiring patterns by abandoning the vertical stacking approach. Instead, multiple coils with standard thickness wiring patterns are arranged adjacently in the same plane, connected in series through connection conductors. This planar configuration allows each coil to maintain adequate wiring thickness, preventing excessive resistance and power loss while still achieving high inductance through the combined effect of multiple coils.
3Length of moving object
If the thickness of the magnetic layer is reduced to increase the number of stacked wiring patterns, then the inductor component can be thinned, but the inductance value decreases due to magnetism saturation and DC superposition performance deteriorates
Solution Approach 1:
The patent resolves this contradiction by arranging multiple coils with magnetic layers adjacently in the same plane rather than stacking them vertically. Each magnetic layer can maintain its full thickness without being compressed by additional stacked layers, preventing magnetism saturation. The parallel arrangement of multiple coils with adequately thick magnetic layers achieves high inductance while maintaining DC superposition performance and avoiding the deterioration associated with reduced magnetic layer thickness.
4Volume of moving object
If the inductor component is miniaturized, then the overall size is reduced, but it becomes difficult to achieve high inductance values
Solution Approach 1:
The patent achieves miniaturization by transitioning from vertical stacking to planar arrangement of multiple coils. This configuration optimizes the use of the available planar space, allowing multiple coils to be packed efficiently in the same plane with their axes parallel to each other. The inductance is increased through the series connection of multiple coils in the planar arrangement, achieving high inductance values within a compact footprint and reduced overall size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances inductance value while maintaining a thin profile, reducing power loss and minimizing magnetism saturation, thus achieving high performance without deteriorating the inductor component's performance.
Implementation Method 1
a first coil and a second coil that are disposed on the same plane in the element body and are adjacent to each other... an axis of the first coil and an axis of the second coil are orthogonal to the plane and are disposed parallel to each other
Data Source
AI summary
An inductor component includes an element body including a magnetic layer, a first coil and a second coil that are disposed adjacent to each other on a plane in the element body, and a first connection conductor that connects the first coil and the second coil. A first axis of the first coil and a second axis of the second coil are disposed parallel in a first direction that is orthogonal to the plane. A shortest distance between the first coil and the second coil is equal to or greater than a larger wiring width of a first wiring width of the first coil and a second wiring width of the second coil, and is equal to or less than an average value of a first diameter of a first smallest circle enclosing the first coil and a second diameter of a second smallest circle enclosing the second coil.