Antenna Component Carrier Layout With Opposed Thermal Coupling
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Solution Overview
Problem
The increasing heat generation by high-frequency chips and component carriers in electronic devices poses a challenge for efficient heat removal, limiting performance and reliability, while maintaining mechanical robustness and electrical reliability under harsh conditions.
Innovation Solution
The electronic device is designed with a first component carrier having an integrated antenna structure and electronic components, and a second component carrier with a heat removal structure, spatially separating wireless signal transmission and heat removal functionalities. The heat removal structure includes highly thermally conductive blocks connected to a cooling unit, ensuring efficient heat dissipation through a thermally conductive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high-frequency chips with increased functionality and miniaturization are employed, then product functionality and component density are improved, but heat generation increases and heat removal becomes more difficult
Solution Approach 1:
The device is divided into two separate component carriers: the first component carrier contains the antenna structure and electronic components, while the second component carrier is dedicated to heat removal functionality. This segmentation allows each carrier to be optimized for its specific function, enabling high-frequency operation with effective heat management.
Solution Approach 2:
A thermally conductive coupling structure is introduced as an intermediary between the first and second component carriers. This coupling structure facilitates efficient heat transfer from the heat-generating electronic components to the heat removal structure, while maintaining mechanical and electrical integrity of the overall device.
2Adaptability or versatility
If electronic components are mounted on component carriers with increased component density, then functionality is improved, but heat removal efficiency deteriorates
Solution Approach 1:
The system is segmented into a first component carrier for high-density electronic component mounting and a second component carrier dedicated to heat removal. This separation ensures that heat removal efficiency is not compromised by increased component density on the first carrier.
Solution Approach 2:
The thermally conductive coupling structure acts as an intermediary that bridges the high-density electronic component carrier and the heat removal carrier, ensuring efficient heat transfer despite the compact arrangement of components.
3Reliability
If component carriers are designed for mechanical robustness under harsh conditions, then reliability is improved, but heat removal capability may be limited
Solution Approach 1:
The device is segmented into two specialized carriers: the first carrier is optimized for mechanical robustness and electrical reliability under harsh conditions, while the second carrier is optimized for heat removal. This segmentation allows each carrier to be designed for its primary function without compromise.
Solution Approach 2:
The thermally conductive coupling structure serves as a mediator that connects the mechanically robust first carrier with the heat removal second carrier, enabling effective heat transfer while maintaining the mechanical integrity required for harsh condition operation.
4Device complexity
If antenna structure and heat removal structure are integrated on the same component carrier, then device complexity is reduced, but signal transmission reliability and heat removal efficiency conflict
Solution Approach 1:
The antenna structure and heat removal structure are segmented onto separate component carriers to eliminate interference between electromagnetic signal transmission and heat removal processes. This segmentation ensures signal transmission reliability while maintaining heat removal efficiency.
Solution Approach 2:
The thermally conductive coupling structure acts as an intermediary that enables thermal connection between the two carriers without compromising the electromagnetic integrity of the antenna structure. This intermediary approach maintains signal transmission reliability while achieving effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively removes heat from electronic components, minimizing thermal stress and signal loss, enhancing the device's reliability and allowing miniaturization of the antenna array.
Implementation Method 1
the heat removal structure comprises at least one highly thermally conductive block, positioned at the opposing other side of the electronic device so as to be thermally connectable with a cooling unit
Data Source
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AI summary
An electronic device (100) which comprises a first component carrier (102) which comprises a first stack (104), having at least one first electrically conductive layer structure (106) forming an antenna structure (110) and having at least one first electrically insulating layer structure (108), wherein the first component carrier (102) further comprises at least one electronic component (112, 114), and a second component carrier (116) having at least one second electrically conductive layer structure (120) and/or at least one second electrically insulating layer structure (122), wherein the second component carrier (116) further comprises a heat removal structure (124), wherein the first component carrier (102) and the second component carrier (116) are connected so that the antenna structure (110) is positioned at one side (126) of the electronic device (100) for emitting and/or receiving electromagnetic radiation and the heat removal structure (124) is positioned at an opposing other side (128) of the electronic device (100).