Integrated Magnetic Circuit Component With Through-Layer Winding
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Solution Overview
Problem
Conventional circuit components with magnetic cores require complex processes and larger sizes due to the need for an annular magnetic core within an insulating layer, limiting manufacturing simplicity and component miniaturization.
Innovation Solution
A circuit component design featuring a magnetic layer with through-holes formed using laser direct structuring, where the magnetic core is integrated within the component, and wiring segments penetrate the magnetic layer, simplifying manufacturing and reducing size by eliminating the need for an external magnetic core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an annular magnetic core is used within an insulating layer, then the circuit component achieves proper magnetic function, but the manufacturing process becomes complex and the component size increases
Solution Approach 1:
The patent merges the magnetic core formation with the insulating layer structure by using laser direct structuring to create through-holes that penetrate both layers simultaneously. The magnetic material is deposited directly into these through-holes, integrating what were previously separate manufacturing steps into a unified process, thereby reducing overall manufacturing complexity while maintaining magnetic functionality.
Solution Approach 2:
The patent replaces traditional mechanical drilling or punching methods with laser direct structuring to create through-holes in the insulating layer. This substitution enables more precise hole formation, easier integration with subsequent magnetic material deposition, and reduced mechanical stress on the components, thereby simplifying the overall manufacturing process.
2Reliability
If an annular magnetic core is used within an insulating layer, then the circuit component achieves proper magnetic function, but the component size increases
Solution Approach 1:
The patent transitions from a traditional planar arrangement where the magnetic core sits on top of the insulating layer to a three-dimensional integrated structure where the magnetic core penetrates through the insulating layer via vertical through-holes. This dimensional change allows for more compact component design while maintaining the necessary magnetic path, thereby reducing overall component volume.
Solution Approach 2:
The patent implements a nested structure where the magnetic core material is positioned within the through-holes of the insulating layer, effectively nesting the magnetic functional element inside the structural layer. This nesting approach eliminates the need for additional space above or below the insulating layer, thereby minimizing component size while preserving magnetic functionality.
3Reliability
If an annular magnetic core is used within an insulating layer, then the circuit component achieves proper magnetic function, but the manufacturing process requires more steps
Solution Approach 1:
The patent performs preliminary laser direct structuring to create through-holes in the insulating layer before depositing the magnetic material. This preliminary action prepares the structure in advance, allowing the magnetic material to be directly deposited into pre-formed pathways, thereby eliminating the need for subsequent alignment and positioning steps that would otherwise be required, thus improving manufacturing efficiency.
Solution Approach 2:
The patent combines the through-hole formation and magnetic core creation into a single integrated manufacturing sequence using laser direct structuring followed by direct magnetic material deposition. This merging of previously separate operations (hole formation, core placement, insulation) into a streamlined sequence reduces the total number of manufacturing steps and improves productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces component size, and enhances electrical connections, making the circuit component more compact and efficient.
Implementation Method 1
forming first through-holes that penetrate the magnetic layer and the second insulating layer
Data Source
AI summary
A circuit component includes a magnetic layer, a first insulating layer, a second insulating layer, and a wiring. The first insulating layer is stacked on a first side in a thickness direction relative to the magnetic layer, and the second insulating layer is stacked on a second side in the thickness direction relative to the magnetic layer. The wiring includes a first wiring layer located between the magnetic layer and the first insulating layer, a second wiring layer located on the second side in the thickness direction relative to the second insulating layer, and a first through-wiring segment penetrating the magnetic layer and the second insulating layer and connected to the first wiring layer and the second wiring layer. The first wiring layer, the second wiring layer, and the first through-wiring segment constitute a winding segment.