In-mold electronic component and method for manufacturing the same
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Solution Overview
Problem
Conventional home appliances and electronic products face challenges due to complex structures, heavy weight, cumbersome manufacturing processes, poor waterproof and weather resistance, and poor impact resistance, particularly when integrating printed circuit boards and electronic components.
Innovation Solution
The development of an in-mold electronic (IME) component that integrates a circuit layer, display unit, and touch unit within a plastic layer through an injection molding process, with a lead-out terminal for direct electrical connection to external components, avoiding the need for connecting cables and reducing the risk of brittle fracture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional integrated circuit boards and electronic components are assembled behind plastic components, then functional requirements are met, but the structure becomes complex and weight increases
Solution Approach 1:
The patent merges the plastic component housing with the circuit board into a single integrated structure. The circuit board is formed as an integral part of the plastic component through injection molding, eliminating the need for separate assembly of the circuit board behind the plastic housing. This integration directly reduces structural complexity while maintaining all electronic functions.
Solution Approach 2:
The plastic component serves multiple functions simultaneously: it acts as both the protective housing and the circuit board substrate. The injection molded plastic component incorporates circuit traces and mounting features directly, allowing it to perform both structural enclosure and electronic circuit functions, thereby reducing the number of separate components needed.
2Reliability
If conventional integrated circuit boards and electronic components are assembled behind plastic components, then functional requirements are met, but weight increases
Solution Approach 1:
By combining the housing and circuit board into a single injection molded plastic component, the patent eliminates the weight of separate metal or rigid substrate materials that would be needed for traditional circuit boards. The plastic material provides both structural support and electrical circuit functionality, reducing overall component weight.
3Reliability
If connecting cables are used for electrical connection, then electrical connectivity is achieved, but the risk of brittle fracture increases
Solution Approach 1:
The patent integrates the electrical circuit traces directly into the plastic component housing through injection molding with conductive materials. This eliminates the need for separate connecting cables that could become brittle and fracture. The circuit traces are permanently embedded in the plastic matrix, providing robust electrical connections that move with the component without risk of cable fatigue or fracture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IME component achieves a lighter, thinner, and non-detachable structure with enhanced moisture resistance, weather resistance, and impact resistance, while ensuring reliable electrical connections by eliminating the need for bending cables and reducing the risk of brittle fracture.
Implementation Method 1
forming a plastic layer between the first film layer and the second film layer through an injection molding process
Data Source
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AI summary
An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic component. The functional module includes a circuit layer and an electronic component electrically connected to circuit layer. The plastic layer is configured to seal the functional module. One end of the lead-out terminal is electrically connected to the circuit layer, and the other end of the lead-out terminal is led out to a rear surface of the in-mold electronic component.