COF Display Pad Layout for High-Density Driver Terminals
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Solution Overview
Problem
High-resolution display devices face challenges in accommodating multiple channels of data driver integrated circuits due to increased data pitch and lead terminal constraints, particularly with the chip-on-film (COF) method, which limits the number of lead terminals that can be disposed on a film.
Innovation Solution
A flexible printed circuit film with multiple lead terminal rows arranged in a staggered configuration on two films, where the second film protrudes beyond the first film, allowing for increased lead terminal density and connection to pad terminals, enabling efficient signal transmission to the data driver integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the chip-on-film (COF) method is used to connect the data driver integrated circuit to the display panel, then the driver circuit can be flexibly mounted, but the number of lead terminals that can be disposed on the film is limited, which restricts high-resolution multi-channel applications
Solution Approach 1:
The patent transitions from a single-plane lead terminal arrangement to a three-dimensional stacked configuration using multiple films (first film and second film) positioned at different heights. The second film protrudes beyond the first film, creating vertical layering that allows lead terminals to be arranged in multiple rows across different planes, effectively increasing the number of available connection points without expanding the horizontal footprint.
Solution Approach 2:
The patent implements a nested structure where the second film is positioned on top of the first film, with the second film's lead terminals arranged in rows that overlap or interleave with the first film's lead terminals. This nested arrangement allows multiple channels to be accommodated within the same spatial envelope by utilizing vertical stacking and overlapping terminal patterns.
2Quantity of substance
If the number of lead terminals is increased to support high-resolution multi-channel displays, then more data channels can be accommodated, but the data pitch increases and the film area required expands
Solution Approach 1:
The patent utilizes vertical stacking with the second film protruding beyond the first film to arrange lead terminals in multiple rows at different heights. This three-dimensional arrangement allows a high density of lead terminals to be packed into a compact horizontal footprint, as terminals are distributed across multiple vertical layers rather than spread out in a single plane.
Solution Approach 2:
The patent divides the lead terminal arrangement into multiple segments organized in distinct rows across the first and second films. The lead terminals are segmented into first rows on the first film and second rows on the second film, with staggered positioning that optimizes space utilization. This segmentation allows efficient packing of numerous terminals without requiring proportional increases in film area.
3Quantity of substance
If lead terminals are arranged in multiple rows to increase connection density, then more channels can be connected, but the complexity of wiring and connection increases
Solution Approach 1:
The patent combines the lead terminal functions of multiple channels into an integrated multi-row arrangement across the first and second films. Rather than treating each channel's connections separately, the design merges all lead terminals into a unified staggered pattern where terminals from different channels are systematically organized in overlapping rows, simplifying the overall wiring architecture despite the high terminal count.
Solution Approach 2:
The patent resolves wiring complexity by transitioning to a three-dimensional lead terminal arrangement where the second film protrudes beyond the first film. This vertical layering allows signal pathways to be routed through different planes, reducing cross-interference and simplifying connection routing compared to attempting to arrange all terminals in a single crowded plane.
Data Source
AI summary
A display device comprises a pad terminal area and a first circuit board attached to the pad terminal area. The pad terminal area comprises a first pad terminal area having a first pad terminal row of first pad terminals and a second pad terminal area having a second pad terminal row of second pad terminals. The first circuit board comprises a first film having a first lead terminal row of first lead terminals and a second film having a second lead terminal row of second lead terminals. The first lead terminals are connected to the first pad terminals, the second lead terminals are connected to the second pad terminals, an end of the second film protrudes outward from an end of the first film, and the second pad terminal area overlaps an area between the end of the first film and the end of the second film.