Embedded Component Carrier With Protruding Pads for Reliable Plating
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Solution Overview
Problem
Existing component carriers face challenges in embedding components with proper electric reliability and mechanical robustness, especially under harsh conditions, due to the complexity of manufacturing and adhesion issues with electroless plated materials on dielectric surfaces.
Innovation Solution
A component carrier manufacturing method involving elevated electrically conductive pads protruding beyond the dielectric material of the redistribution layer, allowing for underfilling with laminate resin and subsequent electroless plating without the need for sputtering, ensuring proper adhesion and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electroless plating is used to deposit conductive material on dielectric surfaces, then manufacturing complexity is reduced, but adhesion reliability deteriorates due to poor adhesion on materials like polyimide
Solution Approach 1:
The patent applies preliminary action by depositing a first electrically conductive material layer before the dielectric material layer, creating a protruding pad structure that extends beyond the dielectric surface. This preliminary conductive layer serves as a pre-prepared adhesion substrate for subsequent electroless plating operations, eliminating the need for sputtering while ensuring proper adhesion.
Solution Approach 2:
The patent changes the physical parameters of the conductive material deposition by using electroless plating instead of sputtering. This parameter change is enabled by the protruding pad structure, which provides a metal surface that accepts electroless plating solution, thereby achieving both manufacturing simplicity and adhesion reliability.
2Reliability
If sputtering is used to deposit electrically conductive material on dielectric surfaces, then adhesion reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent creates a preliminary protruding pad structure with electrically conductive material that extends beyond the dielectric surface before final assembly. This preliminary structure enables the use of simpler electroless plating processes instead of complex sputtering equipment and procedures.
Solution Approach 2:
The patent substitutes the mechanical/physical sputtering process with a chemical electroless plating process. The protruding pad structure enables this substitution by providing a metal surface that catalyzes electroless plating, replacing the need for vacuum-based sputtering machinery and procedures.
3Ease of manufacture
If pads are flush with the dielectric surface, then manufacturing simplicity is maintained, but adhesion reliability deteriorates due to inability to plate on dielectric materials
Solution Approach 1:
The patent introduces asymmetry in the pad structure by making the pads protrude vertically beyond the dielectric surface rather than being flush with it. This asymmetric protruding structure creates a metal surface that is accessible for electroless plating, thereby achieving both manufacturing simplicity and adhesion reliability.
Solution Approach 2:
The patent transitions from a two-dimensional flush pad layout to a three-dimensional protruding pad structure. This dimensional change adds vertical height to the pads, creating a metal surface that extends above the dielectric level and can be plated with additional conductive material using electroless plating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, enhances mechanical stability, and achieves high electric reliability by eliminating the need for sputtering and ensuring proper adhesion of conductive materials, even on non-electroless plateable materials like polyimide.
Implementation Method 1
said underfill material may then be covered, together with exposed surfaces of the protruding pad(s), with additional electrically conductive material
Implementation Method 2
it may be in particular possible to carry out a standard electroless plating procedure for creating the additional electrically conductive material with proper adhesion
Data Source
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Figure 4~5
AI summary
The invention relates to a component carrier (100) comprising a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a component (108) embedded in the stack (102), wherein the component (108) comprises a redistribution structure (110) with at least one vertically protruding electrically conductive pad (112), and electrically conductive material (116) on at least part of said at least one pad (112). The invention also relates to a method of manufacturing a component carrier (100).