Dual-Sided Spiral Wiring Board Layout for Thin Coil Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing printed wiring boards require additional thickness when connection lands are disposed on separate boards, leading to increased thickness of coil devices.
Innovation Solution
A printed wiring board design where the first and second connection lands are formed on the second main surface, with the first coil wiring having more turns and a larger area ratio than the second coil wiring, allowing for reduced thickness while maintaining Lorentz force in coil devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection lands are disposed on a separate printed wiring board, then electrical connection is achieved, but the thickness of the coil device increases
Solution Approach 1:
The patent combines the connection lands with the same printed wiring board that carries the coil wiring, rather than using a separate board. Specifically, the first and second connection lands are disposed on the printed wiring board at positions corresponding to the first and second ends of the coil wiring, respectively, allowing electrical connection while maintaining a compact single-board structure that reduces overall device thickness.
2Force
If the number of turns of coil wiring is increased to maintain Lorentz force, then the area ratio increases, but the thickness constraint becomes more difficult to satisfy
Solution Approach 1:
The patent utilizes the third dimension (thickness direction) by forming coil wiring on both the first main surface and the second main surface of the printed wiring board. This allows the coil wiring to extend in the thickness direction while maintaining a compact overall structure, enabling sufficient number of turns for adequate Lorentz force without excessive planar area occupation.
Solution Approach 2:
The patent creates asymmetric coil wiring configurations where the first coil wiring and second coil wiring can have different numbers of turns and different area ratios. Specifically, the number of turns of the first coil wiring is set to be greater than that of the second coil wiring, allowing optimization of Lorentz force generation while controlling the overall area ratio and maintaining thickness constraints.
3Force
If the area ratio of coil wiring is optimized for Lorentz force, then the number of turns increases, but the device complexity increases
Solution Approach 1:
The printed wiring board serves multiple functions: it carries the coil wiring for Lorentz force generation, provides connection lands for electrical connection, and integrates the entire coil device structure in a single component. This multi-functionality eliminates the need for separate connection boards and reduces overall device complexity while maintaining adequate Lorentz force through optimized coil wiring configuration.
Data Source
AI summary
A printed wiring board includes a base film having a main surface, a coil wiring formed on the main surface, and a first connection land and a second connection land connected to one end and another end of the coil wiring, respectively. The main surface includes a first main surface and a second main surface opposite to the first main surface. The coil wiring includes a first coil wiring formed in a spiral shape on the first main surface, and a second coil wiring formed in a spiral shape on the second main surface and electrically connected to the first coil wiring. The first connection land and the second connection land are formed on the second main surface. The number of turns of the first coil wiring is more than the number of turns of the second coil wiring.