In-Mold Electronic Component Structure for Sealed Circuit Integration
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Solution Overview
Problem
Conventional home appliances and electronic products face challenges such as complex structures, heavy weight, cumbersome manufacturing processes, poor waterproof performance, poor weather resistance, and poor impact resistance due to the use of integrated circuit boards and plastic components.
Innovation Solution
The development of an in-mold electronic (IME) component that includes a first film layer, a functional module with a circuit layer and electronic components, a plastic layer for sealing, and a lead-out terminal for direct electrical connection to external components, all integrated through an injection molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional integrated circuit boards and plastic components are used, then electrical connection and structural support are achieved, but the structure becomes complex and weight increases
Solution Approach 1:
The patent merges the circuit board, electronic components, and plastic housing into a single integrated mold structure. The circuit board is directly embedded within the plastic housing during injection molding, eliminating the need for separate assembly steps and reducing structural complexity while maintaining electrical connection reliability.
Solution Approach 2:
The plastic housing serves multiple functions simultaneously: it provides structural support, acts as an insulator, serves as a mounting substrate for electronic components, and provides environmental protection. This multi-functionality reduces the need for separate components and simplifies the overall structure.
2Strength
If conventional integrated circuit boards and plastic components are used, then structural support is achieved, but weight increases
Solution Approach 1:
The patent uses composite materials by integrating the circuit board (typically fiberglass-reinforced epoxy) with the plastic housing (polymer material) in a single molded structure. This composite construction provides adequate structural support while potentially reducing weight compared to traditional multi-component assemblies with metal fasteners and separate housings.
3Ease of manufacture
If conventional plastic components are used, then manufacturing is achieved, but waterproof performance and weather resistance deteriorate
Solution Approach 1:
The circuit board and plastic housing are merged into a single injection-molded component, creating seamless joints without gaps or seams where water could penetrate. This integrated structure inherently provides waterproof performance while maintaining manufacturing efficiency through a single molding process.
4Ease of manufacture
If conventional plastic components are used, then manufacturing is achieved, but impact resistance deteriorates
Solution Approach 1:
The integration of the circuit board (with its inherent rigidity and strength) within the plastic housing creates a composite structure that enhances impact resistance. The circuit board acts as an internal reinforcement, distributing impact forces throughout the structure and preventing catastrophic failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IME component achieves a lighter, thinner, and non-detachable structure with enhanced moisture resistance, weather resistance, impact resistance, and reliable electrical connections, avoiding the issues of brittle fractures and cable bending.
Implementation Method 1
forming a plastic layer between the first film layer and the second film layer through an injection molding process, the plastic layer being configured to seal the decorative layer, the circuit layer, the display unit, and the touch unit
Data Source
AI summary
An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic component. The functional module includes a circuit layer and an electronic component electrically connected to circuit layer. The plastic layer is configured to seal the functional module. One end of the lead-out terminal is electrically connected to the circuit layer, and the other end of the lead-out terminal is led out to a rear surface of the in-mold electronic component.