Adjustable Return Path Magnet Assembly for Sputter Deposition
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Solution Overview
Problem
Conventional sputter deposition equipment faces challenges in achieving uniform film deposition due to process phenomena like the 'cross-corner effect' and process drift, leading to variations in deposition rate across the sputtering target.
Innovation Solution
An adjustable sputter deposition assembly with a magnet assembly that includes a magnetic backing plate and spaced-apart permanent magnets, allowing for local adjustment of the magnetic field without moving the entire magnet assembly, thereby compensating for variations in process conditions and maintaining film uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional sputter deposition equipment is used, then deposition can be performed, but film uniformity deteriorates due to cross-corner effect and process drift
Solution Approach 1:
The patent implements a movable magnet assembly that can be dynamically adjusted relative to the sputtering target. The magnet assembly includes permanent magnets mounted on a movable support structure, allowing the entire magnet assembly to be repositioned to compensate for process drift and cross-corner effects, thereby maintaining film uniformity throughout the deposition process
Solution Approach 2:
The patent changes the spatial parameters of the magnetic field by moving the magnet assembly to different positions and orientations. This allows adjustment of the magnetic field distribution across the target surface to compensate for non-uniform deposition patterns and maintain consistent film quality
2Adaptability or versatility
If the entire magnet assembly is moved to adjust process conditions, then local process control is improved, but device complexity and operational difficulty increase
Solution Approach 1:
The magnet assembly is segmented into independent permanent magnets mounted on a common movable support. This segmentation allows selective movement of individual magnets or groups of magnets to address specific local uniformity issues without requiring movement of the entire magnet assembly, simplifying operation while maintaining local control
3Manufacturing precision
If magnet assembly is moved relative to sputtering target, then deposition uniformity is improved, but mechanical complexity increases
Solution Approach 1:
The movable support structure serves multiple functions: it provides mechanical support for the permanent magnets, enables repositioning to compensate for process drift, and allows adjustment of magnetic field geometry. This multi-functionality reduces the need for separate adjustment mechanisms, thereby reducing overall mechanical complexity while achieving deposition uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables exceptional film uniformity and flexibility in sputter deposition processes by allowing local adjustments to the magnetic field, addressing issues like the cross-corner effect and process drift without the need to move the primary magnets, thus improving the consistency of the sputtering process.
Implementation Method 1
The magnet assembly creates a magnetic field comprising field lines that extend from the proximal end of the first magnet, through the sputtering target, along an arc located in front of the sputtering target, back through the sputtering target, to the proximal end of the second permanent magnet, through the second permanent magnet, along a return path, and to the distal end of the first permanent magnet
Implementation Method 2
The magnet assembly includes a magnetic backing plate and spaced-apart first and second permanent magnets
Data Source
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AI summary
The invention provides a sputter deposition assembly that includes a sputtering chamber, a sputtering target, and a magnet assembly. The magnet assembly includes a magnetic backing plate with a blind recess into which a moveable magnetic control body can be adjustably disposed.