Adjustable Shunt Assembly for Magnetron Sputtering
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Solution Overview
Problem
Magnetron sputtering processes face challenges with non-uniform target erosion and deposition due to localized magnetic fields, requiring frequent adjustments to maintain uniformity, which disrupts production and is time-consuming.
Innovation Solution
An adjustable shunt assembly that allows for real-time adjustment of the magnetic field by moving a shunt between magnets, enabling precise control over target erosion and deposition profiles without stopping production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the magnetic field is adjusted by physically removing and disassembling the magnetron, then the uniformity of thin film deposition can be tuned, but production stops for twelve hours or longer
Solution Approach 1:
The shunt is made movable rather than fixed, allowing it to be adjusted to different positions during operation. The transporter mechanism enables the shunt to be dynamically repositioned between magnets to alter the magnetic field profile, allowing uniformity tuning without complete disassembly and production stoppage
Solution Approach 2:
The adjustment mechanism is segmented into independent components: the shunt can be moved independently by the transporter, and multiple shunts can be adjusted independently. This allows selective adjustment of specific magnetic field regions without requiring complete system disassembly
2Manufacturing precision
If the shunt is moved to adjust the magnetic field profile, then precise control over target erosion and deposition is achieved, but the device complexity increases
Solution Approach 1:
The transporter acts as an intermediary mechanism that simplifies the adjustment process. Instead of directly manipulating the shunt position through complex mechanical linkages, the transporter provides a straightforward means to move the shunt to desired positions, reducing overall system complexity while maintaining precise control capability
Solution Approach 2:
The system controls magnetic field characteristics by changing the position parameter of the shunt rather than altering the magnetic material properties or geometry. This parameter-based control approach simplifies the adjustment mechanism compared to redesigning the magnetic circuit structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous production with precise control over magnetic field intensity and profile adjustments, reducing downtime and ensuring uniformity of thin film deposition.
Implementation Method 1
The magnets are adapted to provide opposing north and south poles producing a magnetic field over the target sputtering surface
Implementation Method 2
Magnetron sputtering is widely used for depositing layers of thin films of material onto a substrate. The process involves vaporizing a material by ion bombardment of a target
Data Source
AI summary
An adjustable shunt assembly for use with a sputtering magnetron having at least two magnets spaced from one another and disposed with respect to a sputtering target having a sputtering surface. The magnets define a longitudinal axis and the adjustable shunt assembly moves a shunt between the two magnets for altering the magnetic field therebetween. A transporter is used for moving the shunt so that such movement may be occurred without disassembling the components of the magnetron and such movement may also be done remotely. A method for moving such shunts is also disclosed.