Adjustable Supporting Base for Test Circuit Contact Alignment
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Solution Overview
Problem
Existing technologies face challenges in achieving effective and proper pressure contact between a test circuit module and a semiconductor element during wafer testing, which is crucial for ensuring the quality and functionality of ICs.
Innovation Solution
An adjustable supporting device is designed to support a test circuit module, featuring a circuit board, fixing modules, and a supporting base with adjustable portions that enhance parallelism and horizontal flatness of contact points through rotational, rotational contact with protrusions and grooves, ball contact, or pogo pin compression, ensuring effective contact with semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed supporting structure is used for the test circuit module, then the device complexity is reduced, but the manufacturing precision of contact point alignment deteriorates
Solution Approach 1:
The supporting base incorporates adjustable portions that can rotate or translate to modify the parallelism between the test circuit module and semiconductor element, transforming a static structure into a dynamic one capable of precise alignment adjustment
Solution Approach 2:
The adjustable portions enable changing geometric parameters such as the angle and position of the supporting base, allowing optimization of contact point alignment by modifying the spatial relationship between components
2Reliability
If the test circuit module is rigidly fixed, then the device complexity is reduced, but the reliability of electrical contact deteriorates
Solution Approach 1:
The adjustable supporting base allows dynamic modification of the test circuit module's position and orientation, enabling reliable electrical contact by adapting to variations in semiconductor element positioning
Solution Approach 2:
The adjustable portions act as intermediaries between the rigid test circuit module and the semiconductor element, absorbing positioning variations and ensuring stable electrical contact
3Measurement precision
If simple contact points are used, then the device complexity is reduced, but the measurement precision of electrical properties deteriorates
Solution Approach 1:
The patent replaces simple mechanical contact points with adjustable supporting structures that provide controlled pressure and alignment, substituting basic mechanical contact with a more sophisticated mechanical system that ensures measurement precision
Data Source
AI summary
An adjustable supporting device including a circuit board, a first fixing module, an adjusting module, a second fixing module, and a supporting base is configured to support a test circuit module. The supporting base is positioned in a first opening of the circuit board, a second opening of the first fixing module, and a third opening of the adjusting module and abuts against the second fixing module and a carrier of the test circuit module. The supporting base includes a first portion abutting against the second fixing module, a second portion connected to a third portion, the third portion connected to a fourth portion, and the fourth portion abutting against the carrier. The first portion and the second portion adjust the parallelism between the test circuit module and a semiconductor element through contact, thereby adjusting the horizontal flatness of multiple contact points of the test circuit module.