Electronic Circuit Testing TRIZ Cases
- Wafer Test Pad with Distributed Vias for Low-Force Probing
Distributed contact vias limit depth loading in wafer test pads, reducing probing force and protecting probe cards.
- Signal-and-Reference Probe with Shielded, Isolated Contact Pin
An isolated, spring-loaded pin adapts to varied test interfaces while a metal body shields signal and reference measurements from interference.
- Invertible Metering Assembly With Removable Language Stencils
Removable language stencils let an invertible meter keep indicia upright across different media-device mounting orientations.
- Thermal-Expansion-Matched Probe Card Interposer for Wafer Contact
Thermal-expansion matching keeps probe tips aligned with wafer pads, while sacrificial layers support tip removal and reuse.
- Self-Contained Computing Device Thermal Cycling for Reliability Testing
Alternating computing workloads create thermal cycles for localized reliability testing without external test vehicles or chambers.