Self-Contained Computing Device Thermal Cycling for Reliability Testing
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Solution Overview
Problem
Conventional thermal test vehicles (TTVs) and temperature chambers for reliability testing of integrated circuits are time-consuming and costly, and may not adequately simulate high temperatures due to limitations of supporting components, necessitating a more efficient and self-contained testing method.
Innovation Solution
A computing device with integrated cooling and circuitry that alternates between high and low computing activity to generate and manage heat differentially, performing self-contained reliability testing without external TTVs or chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal test vehicles (TTVs) and temperature chambers are used for reliability testing, then long-term reliability verification is achieved, but testing time and cost increase significantly
Solution Approach 1:
The system implements periodic temperature cycling by alternating between high computing activity periods (generating heat) and low computing activity periods (reducing heat generation). This periodic thermal stress testing accelerates reliability verification by repeatedly subjecting components to thermal expansion and contraction cycles, simulating long-term thermal aging in a compressed time frame.
Solution Approach 2:
The computing device under test generates its own thermal stress through its normal computing operations, eliminating the need for external thermal test vehicles or temperature chambers. The device's own processor and components serve as the heat source, and the system autonomously monitors and responds to its thermal state, performing self-contained reliability testing.
2Measurement precision
If thermal test vehicles (TTVs) are designed and manufactured for accurate thermal simulation, then thermal characteristics are accurately reproduced, but design and manufacturing time and cost increase
Solution Approach 1:
The computing device uses its own operational heat generation to create the thermal test conditions, eliminating the need for externally designed thermal test vehicles. The processor and other active components naturally produce the heat required for thermal stress testing, removing the complexity of designing and manufacturing specialized TTVs while maintaining accurate thermal simulation.
Solution Approach 2:
The invention extracts the thermal testing function from the physical test vehicle and embeds it within the computing device's operational characteristics. By utilizing the device's own heat generation during computing operations, the system removes the need for separate thermal simulation hardware, simplifying the overall test setup while preserving thermal testing accuracy.
3Reliability
If temperature chambers are used to push high temperatures for accurate testing, then integrated circuit reliability is accurately verified, but other electrical components (e.g., capacitors) may be damaged due to maximum temperature limits
Solution Approach 1:
The thermal stress is locally concentrated on the integrated circuit and its immediate surroundings through targeted computing workloads that generate heat at the processor level. This localized thermal generation allows the integrated circuit to experience high temperatures for reliability testing while supporting components like capacitors remain at lower temperatures, avoiding thermal damage to temperature-sensitive components.
Solution Approach 2:
The computing device autonomously generates and controls its own thermal environment through software-managed computing workloads. The system can dynamically adjust the intensity and distribution of computing tasks to create localized thermal zones that stress the integrated circuit while preserving supporting components, eliminating the need for uniform high-temperature chamber environments that risk damaging temperature-sensitive parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates faster, more affordable, and localized temperature control for reliability testing, simulating the life expectancy and aging of integrated circuits while avoiding temperature spikes in sensitive components.
Implementation Method 1
periods of high computing activity that increases heat emission
Implementation Method 2
direct the cooling device to decrease cooling power during the periods of high computing activity and increase the cooling power during the periods of low computing activity
Data Source
AI summary
A disclosed computing device capable of performing self-contained reliability testing may include (1) a cooling device and (2) circuitry communicatively coupled to the cooling device, wherein the circuitry is configured to (A) alternate between periods of high computing activity that increases heat emission and periods of low computing activity that decreases the heat emission and (B) direct the cooling device to decrease cooling power during the periods of high computing activity and increase the cooling power during the periods of low computing activity. Various other apparatuses, systems, and methods are also disclosed.