Adjustable Thermal Break for Wafer Support Temperature Control
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Solution Overview
Problem
Current substrate support assemblies face challenges in maintaining precise temperature control during both cryogenic and high-temperature operations in semiconductor manufacturing, leading to limitations in throughput and yield due to inefficient thermal management.
Innovation Solution
A substrate support assembly with an adjustable thermal break between the heater and cooling channel, featuring fluid conduits that allow for varying thermal conductivity by flowing fluids or gases, enabling dynamic control of heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If resistive heaters are used to maintain substrate support temperature, then heating capability is provided, but heat is continuously dumped into the cooling base even when plasma heat load is absent
Solution Approach 1:
A thermal break layer is introduced as an intermediary between the substrate support and cooling base. This thermal break acts as a mediator that controls heat flow, allowing the heaters to warm the substrate support while preventing continuous heat dumping into the cooling base when plasma heat load is absent.
Solution Approach 2:
The thermal conductivity of the interface between substrate support and cooling base is dynamically adjusted by changing the state of the thermal break layer. When plasma heat load is present, the thermal break provides high thermal conductivity; when absent, it transitions to low thermal conductivity to reduce energy loss.
2Temperature
If cooling base thermal mass is used to remove heat, then cooling capability is provided, but heat is continuously pulled away from the substrate support during heating operations
Solution Approach 1:
The thermal break layer serves as a controllable intermediary that regulates heat transfer between the substrate support and cooling base. During heating operations, it prevents excessive heat withdrawal by the cooling base thermal mass, maintaining thermal energy in the substrate support.
Solution Approach 2:
The thermal break layer's thermal conductivity is made dynamic rather than static. It adapts its thermal properties based on operational conditions, providing high conductivity when cooling is needed and low conductivity when heating is required, thereby optimizing energy management.
3Stability of the object's composition
If continuous heating power is supplied to maintain temperature, then temperature stability is achieved, but throughput is limited by temperature change time and settling time
Solution Approach 1:
Instead of continuous heating, the system uses periodic or conditional heating cycles. The thermal break enables rapid temperature adjustments by allowing quick heat removal when needed and rapid heat retention when heating is required, reducing both heating time and settling time while maintaining temperature stability during processing.
Solution Approach 2:
The thermal break enables continuous useful action by maintaining optimal temperature conditions throughout the wafer processing cycle. It prevents temperature fluctuations and overshoots, allowing continuous processing without interruption for temperature stabilization, thereby improving throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved temperature control and faster response times, allowing for efficient processing at both cryogenic and high temperatures, enhancing substrate quality and throughput while reducing operational costs.
Implementation Method 1
An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for varying the thermal conductivity between the heater and the cooling channel.
Implementation Method 2
The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for varying the thermal conductivity
Implementation Method 3
A gas is introduced at a first pressure to an adjustable thermal break disposed between the heater and the cooling base. The gas is introduced at a second pressure different than the first pressure to modify the thermal conductivity between the heaters and the cooling base.
Data Source
AI summary
Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.