Adjustable Thermal Test Vehicle for Multi-Chip Flux Simulation
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Solution Overview
Problem
Designing thermal management systems for bespoke, high-density computing devices with multiple processing units and varying thermal flux and geometries is challenging due to the complexity of simulating precise thermal loads and gradients.
Innovation Solution
A thermal test vehicle (TTV) with movable nodes and stages allows precise simulation of chip or multi-chip module (MCM) designs, replicating size, shape, position, and thermal flux of components using thermally conductive materials and adjustable platforms to test thermal management devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing thermal simulation technologies are used, then thermal management systems can be tested, but precision in simulating varying thermal flux and geometries of MCM components is insufficient
Solution Approach 1:
The thermal simulation device divides the multi-chip module into separate thermal nodes, each representing individual chips or chiplets. Each node can be independently configured with specific geometries, materials, and thermal flux characteristics, enabling precise simulation of complex MCM thermal patterns while maintaining adaptability to different designs.
Solution Approach 2:
The thermal simulation device employs adjustable and reconfigurable thermal nodes that can dynamically change their thermal flux output and geometric configuration. This allows the system to adapt to different MCM designs and thermal scenarios, achieving both high precision and versatility in thermal simulation.
2Reliability
If physical MCM fabrication is performed for testing, then accurate thermal performance data can be obtained, but expensive fabrication costs are incurred
Solution Approach 1:
The invention creates a virtual copy of the multi-chip module using thermal nodes that replicate the thermal characteristics, geometries, and configurations of actual MCM components. This virtual model provides reliable thermal performance data without requiring expensive physical fabrication, enabling iterative design and testing at minimal cost.
Solution Approach 2:
The thermal simulation device allows independent adjustment of thermal flux parameters, material properties, and geometric dimensions for each thermal node. This parameter configurability enables accurate replication of various MCM designs and thermal scenarios, providing reliable test data without the need for physical fabrication across different design iterations.
3Device complexity
If fixed thermal nodes are used in simulation, then device structure is simplified, but adaptability to simulate various chiplet shapes and thermal gradients is reduced
Solution Approach 1:
The thermal simulation device uses universal thermal nodes that can be configured to represent different chiplet types, geometries, and thermal characteristics. Each node can be programmed with specific properties, allowing a single standardized platform to simulate diverse MCM configurations without requiring separate dedicated structures for each scenario.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate testing of thermal management devices before fabrication, simulating thermal profiles and gradients with high precision, allowing for refinement without actual chip or MCM production.
Implementation Method 1
The thermal source is connected to the node to transfer thermal energy between the thermal source and a top surface of the node
Data Source
AI summary
Devices for simulating thermal loads may include a platform, a stage affixed to the platform but having a portion that is moveable relative to the platform, and nodes coupled with the platform. In one example, a node may be affixed to the movable portion of the stage so as to be movable relative to the platform. In another example, a thermal node may be affixed to the movable portion of the stage and provide a thermal flux at a top surface of the thermal node. In another example, the stage may include a first substage that is affixed to the platform and a second substage that is moveable relative to the first substage. A node may be affixed to the second substage so as to be moveable relative to the first substage. Thermal energy may be transferred between the thermal source and a top surface of the node.