Electronic Circuit Testing TRIZ Cases

Programmable core-clock and DQS delay calibration helps DDR controllers capture data despite timing skew, voltage drift, and area limits.

By reusing the PWM loop as a ΣΔ ADC, this Class-D amplifier test circuit cuts external test hardware and improves noise-robust audio measurement.

Embedded sensors, on-chip ADCs, and signal generation cut mixed-signal test time and external instrumentation cost in high-volume production.

Gated clock clearing moves reset logic out of the slave latch to cut scan flip-flop area, routing congestion, and reset power.

Sequential marking of ECC and LDC code segments enables recursive decoding in Blu-ray storage, improving correction of uncorrectable bytes.

Blank replacement records preserve table structure during data deletion, maintaining stable operation and consistent references.

Simultaneous transparency in two latch circuits shortens signal paths and cuts setup delay for faster semiconductor data transfer.

Spare TSVs and multiplexed signal switching reroute data around failed vias to maintain connectivity in 3D semiconductor stacks.

Bit reliability ranking and partial syndrome checks cut LDPC decoding power for punctured, erased, and defect-affected data without major performance loss.

Multiple functionally equivalent FPGA bitstreams rotate disjoint pass-gate subsets to extend IC life and support higher operating voltage.

Precomputed layer-gap indices and circulant pairing reduce LDPC decoder memory accesses, cutting power and memory area while improving convergence.

Multi-level read compression verifies repeating memory test patterns by reading fewer words while preserving data accuracy checks.

Varying voltage or temperature and shifting targeted bit patterns reveals the number and location of scan chain hold time faults.

Using TMS as clock and TCK as bidirectional data bypasses intermediate TAP domains to cut JTAG latency and raise bandwidth.

Parallel LDPC-coded M-ary DPSK enables >100 Gb/s optical transmission with 40 Gb/s components while improving BER and spectral efficiency.

One software model handles programmable IC dies with optional boundaries by using RC termination and invalid-route flags to cut mask-set cost.

A SYNC-started timer detects stalled programmable IC bitstream loads and triggers memory erase or access blocking to prevent bad configuration.

Power-on calibration delays core clock and DQS to handle DDR timing skew without asynchronous FIFOs, reducing latency and silicon area.

Direct test-mode inputs and gated inverter circuits cut scan-path delay, preserving high-frequency register operation during semiconductor testing.

Adaptive control signals compensate clock phase skew in FPGA multiplexed I/O paths, raising frequency while avoiding hold violations.

A user-level CRC instruction moves checksum calculation into the processor pipeline, cutting offload overhead and speeding data handling.

Using four NMOS transistors for both data and scan inputs, this flip-flop cuts area and power while preserving testability and speed.

Time-multiplexed judging circuits and scan registers pinpoint setup violations with few pins while avoiding error propagation to later stages.

By stretching selected circuit modes from the input clock, this case helps pinpoint hold settling and acquisition errors in high-speed multi-mode circuits.

Scannable latch and control scan chains let asynchronous pipelines test data and control paths separately without extra area and power.

Segmented priority encoder logic shortens timing paths and avoids circular combinational loops for higher clock-speed operation.

Independent judging circuits use scanable error registers to pinpoint setup violations without propagating faults to later stages.

Selective IO block mapping lets one chip package design support defective and fully functional multi-core dies with fewer layers and lower cost.

A serial interface module shares test access across CPU cores, cutting JTAG pin count while speeding data transfer and preserving software compatibility.

An enable-controlled buffer bypasses the master latch to correct timing errors at high clock speed without adding large calibration circuits.

During reset, FPGA configuration latches form scan chains to test logic and routing paths without extra silicon or EDA software.

Uses a multiplexer-only ring oscillator to isolate select-to-output delay, track voltage-dependent timing, and support real-time circuit monitoring.

Direct JTAG addressing updates selected PROM configuration data without full erase or reprogramming, cutting downtime and reducing errors.

Text-based trigger expressions stored in PLD memory enable flexible internal signal capture without full reprogramming.

A PLD soft core bridges JTAG and SPI PROM, enabling read, write, and erase access without adding dedicated SPI pins.

A calibration circuit measures MOS gate capacitance and adjusts drive amplitude to keep switching edges consistent and reduce EMI.

Programmable clock delays stagger sequential registers to recover timing margin, reduce logic errors, and avoid costly logic repartitioning.

Generate selectable BER profiles across different error counts and time intervals to evaluate network performance and FEC behavior.

Detected ECC errors drive closed-loop voltage, bias, or clock tuning so IC signal paths cut energy use without retransmission delays.

Continuous checksum monitoring detects soft errors in volatile FPGA configuration memory and triggers automatic reconfiguration during operation.

A recovery module compares FPGA configuration memory with a non-volatile reference copy to detect SEUs and restore corrupted data during operation.

A divider chain with retimer flip-flops replaces complex VCO or PLL schemes to generate wide-range clock frequencies and four output phases.

Synchronized input and hold-loop gate control cuts scan flip-flop set-up delay and power while preserving test capability.

Integrated ECC continuously corrects configuration-memory bit errors during operation, avoiding scrubbing delays and TMR area overhead.

Built-in redundant clusters replace defective logic transparently, improving reconfigurable circuit yield and reliability without changing configuration data.

Movable thermal nodes and stages replicate chiplet geometry and heat flux, enabling precise thermal management testing before MCM fabrication.

Shunt-based impedance sensing detects actuator instability or detachment in hearing prostheses, enabling more accurate mechanical stimulation.

A passive two-phase helium loop and split wafer holder improve cryogenic heat sinking and alignment while keeping wafers flat in vacuum.

Dual Peltier control on the IC socket and PCB keeps semiconductor module temperature uniform without fiber shaking, improving inspection accuracy.

PMU-generated active resistors correct load resistor errors during image sensor testing, enabling denser parallel test setups and automatic calibration.