Semiconductor Module Inspection with Dual Peltier Temperature Control
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Solution Overview
Problem
Existing semiconductor module inspection methods, particularly for optical semiconductor modules, face issues with temperature control accuracy and stability due to fiber shaking and uneven temperature distribution, which affect inspection results.
Innovation Solution
A semiconductor module inspection device with dual temperature control devices, one on the upper and one on the lower surface of the PCB, using Peltier elements and heat dissipation fins to maintain uniform temperature across the module, eliminating fiber shaking and ensuring accurate temperature adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If jet air is used for temperature control, then temperature can be changed easily, but optical fiber shaking occurs affecting inspection results
Solution Approach 1:
The patent replaces the mechanical jet air system with a contact-type temperature control system using a Peltier element. This substitution eliminates the mechanical disturbance (jet air flow) that causes optical fiber shaking while maintaining effective temperature control capability through direct thermal contact with the IC socket.
Solution Approach 2:
The patent introduces an IC socket as an intermediary component between the temperature control device and the optical semiconductor module. The IC socket serves as a thermal conductor that transfers temperature changes from the Peltier element to the module without causing mechanical disturbance, thus enabling temperature control without optical fiber shaking.
2Temperature
If temperature control device is attached to upper portion of IC socket, then temperature control is achieved, but temperature distribution becomes uneven in the optical semiconductor module
Solution Approach 1:
The patent segments the temperature control function into two independent parts: one attached to the upper surface of the IC socket and another attached to the lower surface of the PCB substrate. This segmentation allows simultaneous control of temperature at different locations, enabling uniform temperature distribution throughout the optical semiconductor module while maintaining ease of operation.
3Stability of the object's composition
If thermostatic bath is used for temperature control, then uniform temperature is achieved, but device complexity and space increase
Solution Approach 1:
The patent extracts the essential temperature control function from the complex thermostatic bath system. By using contact-type temperature control devices (Peltier elements) directly attached to the IC socket and PCB, the patent achieves uniform temperature distribution without requiring the complex enclosed bath structure, thereby reducing device complexity and space requirements while maintaining temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides precise temperature control, preventing fiber shaking and ensuring uniform temperature distribution, thereby improving inspection accuracy and reducing costs associated with large, complex equipment.
Implementation Method 1
a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate
Implementation Method 2
a method of changing the upper surface temperature of the IC module by attaching a contact-type temperature control device such as a Peltier element or a fin to the upper portion of the IC socket
Data Source
AI summary
A semiconductor module inspection device of the present disclosure includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In an embodiment, the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin. In an embodiment, the semiconductor module inspection device further includes a chamber structure including a chamber upper portion connected to the heat dissipation surface of the first temperature control device, a chamber lower portion connected to the heat dissipation surface of the second temperature control device, and a purge mechanism for purging the chamber internal space with dried air.