Adjustable Thickness Electronic Device via Protruding Sealing Resin
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Solution Overview
Problem
Existing electronic devices face limitations in design flexibility regarding overall size without compromising the protection of electronic elements, as the size of the sealing resin and columnar conductors is often fixed, restricting the ability to adjust the thickness of the device according to user requests.
Innovation Solution
The electronic device incorporates a substrate with an element-receiving recess and a conductive layer, where the sealing resin and columnar conductors can protrude from the substrate surface, allowing for adjustable thickness without altering the size of the recess or electronic element arrangement, enabling greater design flexibility and manufacturing convenience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing resin and columnar conductor size are fixed to protect electronic elements, then the protection reliability is improved, but the design flexibility and adaptability for different size requirements deteriorates
Solution Approach 1:
The invention divides the electronic device structure into distinct functional zones: the element-receiving recess for protecting electronic elements, and the protruding sealing resin with columnar conductors for external connections. This segmentation allows independent optimization of protection and size adaptability.
Solution Approach 2:
The invention utilizes the thickness dimension by allowing the sealing resin and columnar conductors to protrude from the substrate surface. This dimensional extension enables size adjustment in the thickness direction without affecting the planar protection structure of the element-receiving recess.
2Adaptability or versatility
If the protrusion amount of sealing resin and columnar conductor is adjusted to meet user size requests, then the adaptability for different thickness requirements is improved, but the manufacturing complexity increases
Solution Approach 1:
The element-receiving recess is pre-formed in the substrate before mounting electronic elements. This preliminary structuring establishes a fixed protection framework that simplifies subsequent assembly and allows independent adjustment of the sealing resin protrusion without affecting element placement.
Solution Approach 2:
The invention applies different structural characteristics to different regions: the element-receiving recess maintains fixed dimensions for protection, while the sealing resin and columnar conductors allow variable protrusion for size adaptation. This local differentiation resolves the contradiction between protection reliability and size flexibility.
Data Source
AI summary
An electronic device includes a semiconductor substrate, an electronic element mounted on the substrate, a conductive layer electrically connected to the electronic element, a sealing resin and a columnar conductor. The substrate has a recess formed in its obverse surface. The electronic element is mounted on the bottom surface of the recess. The conductive layer has an obverse-surface contacting region located on the obverse surface of the substrate. The sealing resin is disposed in at least a part of the recess for covering at least a part of the obverse surface of the substrate. The columnar conductor is electrically connected to the obverse-surface contacting region of the conductive layer and exposed from the sealing resin at a side opposite to the obverse surface of the substrate.