Printed Electric Component Incorporation TRIZ Cases

Segmented lower and upper holders apply targeted pressing force to lead wire legs, resolving the trade-off between assembly ease and vibration resistance.

A thermally insulating polymeric coat isolates high-capacitance inductors during molding.

Curved protrusion electrodes distribute stress to prevent breaks in narrow-pitch chip-on-film wiring boards.

A circuit substrate power ground plane uses intersecting grid lines to define holes while preserving solid copper regions near the periphery.

Thinned insulating substrate regions absorb dimensional errors, preventing semiconductor detachment from heat sinks.

An embedded ceramic member reduces material waste while improving thermal management for high-heat-generating products.

A ceramic multilayer substrate uses a recess portion to contain plating liquid and maintain surface electrode adhesion.

Smaller radio frequency pads on the land grid array module reduce parasitic capacitance to maintain impedance continuity across wide frequency bands.

An oxide buffer layer reduces thermal stress during copper deposition, preventing slot substrate warping and improving mass production reliability.

Acid-modified vinylaromatic block copolymer adhesives seal optoelectronic devices against water vapor permeation while maintaining mechanical flexibility.

Composite electrode layers with controlled nickel oxide thickness maintain insulation resistance under high humidity.

Segmenting RF circuits into stacked sub-assemblies with peripheral walls improves power handling and frequency performance at high frequencies.

A wiring board employs a tapered through-hole conductor to balance thermal expansion and suppress warping caused by mismatched material properties.

Bridging conductive pads with solder eliminates zero-ohm resistors, reducing component count and manufacturing defects while maintaining testing accessibility.

Solder paste seals PCB through holes to prevent underfiller overflow and improve junction reliability.

Elliptical adhesive layer apertures increase usable contact surface area by 83% while maintaining manufacturing simplicity.

A tapered bump electrode projects from a non-uniform wiring layer to distribute thermal expansion differences between the semiconductor device and substrate.

A circuit board forms multiple conductive channels within a single through hole to expand layout area and increase flexibility.

A terminal supports an electronic part above a board using a fuse wiring member to prevent reconnection.

A semiconductor substrate with an element-receiving recess supports a conductive layer and protruding sealing resin for flexible device thickness.

Segmented sensing films on an LCR resonator improve selectivity for chemical and biological species while reducing recovery time.

Setting terminal electrode thickness below conductive pattern levels prevents crack formation and warping while maintaining reliable electrical connections.

External connection terminals with differentiated line widths reduce contact area to enhance connection reliability in touch sensor films.

A temperature-responsive layer with a planar-convex or concave cross-section bonds to integrated circuit packages to counteract thermal warpage.

An integrated circuit board embeds a fuel cell via conductive vias and porous electrodes, reducing power consumption by shortening electrical connection paths.

Etching a notch antenna into the ground plane eliminates external protrusions while maintaining reliable wireless transmission.

A composite wiring substrate couples oxidized aluminum portions to a frame-like aluminum substrate for enhanced mechanical strength.

An organic transistor uses a second insulating layer with electrophilic groups to reduce threshold voltage and improve the ON-OFF ratio.

Localized conductive patterns in a multilayer board maintain consistent through hole depth during hot pressing, resolving flatness variation issues.

A flexible substrate integrates passive circuit components and IC dies using metal-filled vias for efficient interconnection.

A laminate insert package embeds semiconductor chips between metal foils using a lamination process to create a compact sandwich structure.

A buffer circuit uses current-control biasing and antiphase inductor fields to stabilize clock signal switching performance.

Fuse-like sensors detect structural flaws through conductive path interruption, eliminating vacuum-based inspection access issues.

Molding resin covers the coreless substrate surface while an interposer matches thermal expansion, preventing warpage during chip mounting.

Optimized electrode geometry and glass-metal paste composition enhance mechanical strength in thin multilayer ceramic capacitors.

Carrier boards with through holes house embedded semiconductor components sealed by protecting layers and fixed by a dielectric layer to reduce space waste.

Offset external connection terminals from internal pads to distribute thermal stresses across the substrate structure.

Opposite jig rotation counteracts continuous directional stress, preventing deformation and maintaining flatness during roll cycles.

A lid with a discontinuous solder precoat forms a controlled ventilation hole in an electronic component package.

A printed circuit board integrates basic and auxiliary shields to suppress standing waves in shielded cables.

Liquid crystal polymer transformer replaces wire winding with printed circuits, reducing size while maintaining magnetic coupling.

Offset integrated circuit package-on-package stacking places components on a mold cap to increase density.

A mounting substrate embeds microelectronic dies to reduce signal path lengths and enhance heat distribution.

A low resistivity substrate hosts conductive components on opposite surfaces linked by pathways through a filled cavity.

A pressure sensor module detects touch on metal frames using fullerene resistors.

An integrated PCB structure merges heat dissipation with impedance matching to eliminate transmission line losses and cooling requirements.

Hybrid via structures eliminate unused stubs that degrade signal integrity, supporting high-speed data transmission without costly back drilling.

An inner layer fuse pattern confined by insulating members breaks DC current while preventing fused material scattering to other circuits.

A component carrier features a conductive bridge structure within a through hole to maintain electrical integrity.