Component Carrier Bridge Structure in Through Hole
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Solution Overview
Problem
Component carriers face challenges in achieving both mechanical robustness and electrical reliability, especially with the increasing miniaturization of components and the need for efficient heat removal, while maintaining proper electrically conductive layer structures and avoiding issues like cracks and voids in conductive fillings.
Innovation Solution
A component carrier design featuring a through hole with tapering portions and an electrically conductive bridge structure, where the bridge structure is delimited by demarcation surfaces and has a central bridge plane with specific intersection points and perpendicular distances to ensure reliable filling and connectivity, enhancing mechanical and electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the component carrier is miniaturized to accommodate more components with smaller spacing, then the quantity of components and integration density are improved, but the mechanical robustness and electrical reliability deteriorate
Solution Approach 1:
The patent applies local quality by creating a bridge structure with specific geometric characteristics (minimum distance of 8μm from the central bridge plane to the sidewall) in critical areas of the through hole. This localized structural enhancement ensures adequate copper filling and mechanical support at the via region without requiring overall enlargement of the component carrier, thus maintaining miniaturization while improving electrical reliability at critical connection points.
2Productivity
If the component carrier is miniaturized to accommodate more components with smaller spacing, then the quantity of components and integration density are improved, but the mechanical robustness deteriorates
Solution Approach 1:
The bridge structure with minimum 8μm distance requirement provides localized mechanical reinforcement at the through hole region. This localized strengthening enhances the overall mechanical robustness of the miniaturized carrier without requiring proportional increases in the size of all components, thus maintaining high integration density while improving mechanical strength at critical load-bearing via regions.
3Ease of manufacture
If conventional through hole filling is used without specific bridge structure design, then the manufacturing process is simpler, but cracks and voids form in the conductive filling reducing reliability
Solution Approach 1:
The patent applies preliminary action by pre-defining the bridge structure geometry (with minimum 8μm distance from central bridge plane to sidewall) before the copper filling process. This pre-established geometric constraint ensures that the subsequent filling process produces a reliable conductive structure without cracks or voids, while the bridge structure itself serves as a template that guides the filling process to achieve proper copper distribution.
4Temperature
If efficient heat removal is implemented through increased component density, then the thermal management is improved, but the mechanical and electrical reliability under thermal cycles deteriorates
Solution Approach 1:
The bridge structure with minimum 8μm distance requirement provides localized thermal management enhancement at the through hole region. This structured design creates adequate thermal pathways and stress distribution zones that facilitate heat removal from high-density components while simultaneously providing mechanical compliance and electrical reliability under thermal cycling conditions.
Data Source
AI summary
A component carrier with an electrically insulating layer structure has opposed main surfaces, a through-hole, and an electrically conductive bridge structure connecting opposing sidewalls delimiting the through-hole. The sidewalls have a first tapering portion extending from a first main surface and a second tapering portion extending from a second main surface. A first demarcation surface faces the first main surface and a second demarcation surface faces the second main surface. A central bridge plane extends parallel to the first main surface and the second main surface and is at a vertical center between a lowermost point of the first demarcation surface and an uppermost point of the second demarcation surface. A first intersection point is between the central bridge plane and one of the sidewalls delimiting the through hole. A length of a shortest distance from the first intersection point to the first demarcation surface is at least 8 μm.