LCP Transformer Using Printed Windings for Miniaturization
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Solution Overview
Problem
Traditional wire-wound core transformers are too large and costly for miniature, low-cost, small-signal applications, particularly in portable designs, and existing alternatives using ceramic or ferrite materials require wire winding, which is undesirable for high-frequency, low-profile designs.
Innovation Solution
The use of traditional thick film printing and commercially available multilayer ceramic (ferrite) tape processing with metallic thick film conductors, such as silver or gold, integrated with a ceramic or liquid crystal polymer (LCP) core, eliminating the need for wire winding and enabling a compact, flexible transformer design with tightly coupled primary and secondary windings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional wire-wound core technology is used, then transformer functionality is achieved, but the transformer size becomes prohibitively large for portable designs
Solution Approach 1:
The patent replaces the traditional mechanical wire-winding process with a printed circuit board-based construction method. Conductive traces are printed directly onto the PCB substrate to form transformer windings, eliminating the need for manual or automated wire winding. This substitution dramatically reduces transformer size while maintaining functionality and simplifying the manufacturing process through standard PCB fabrication techniques.
Solution Approach 2:
The patent changes the physical parameters of the transformer construction by transitioning from three-dimensional wire-wound cores to planar printed traces on a PCB. This parameter change enables miniaturization while maintaining the electromagnetic coupling function through optimized trace geometry and substrate material selection.
2Temperature
If ceramic or ferrite materials with wire winding are used, then magnetic properties are achieved, but the design becomes unsuitable for high-frequency, low-profile applications
Solution Approach 1:
The patent transitions from vertical wire-wound construction to horizontal planar traces on a PCB substrate. This dimensional change enables the transformer to achieve its magnetic coupling function in a planar configuration rather than requiring vertical height, thus creating a low-profile design suitable for high-frequency applications where space is constrained.
Solution Approach 2:
The patent utilizes the thin film nature of printed circuit board traces to create a flattened transformer structure. The conductive traces, being thin films deposited on the PCB substrate, enable the transformer to achieve minimal profile height while maintaining electrical continuity and magnetic coupling functionality for high-frequency operation.
3Adaptability or versatility
If thick film printing with metallic conductors is used, then conductor integration is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent makes the PCB substrate serve multiple functions: it provides the mechanical support structure, the electrical conductor paths through printed traces, and the insulation between windings. This multi-functionality integrates the conductor and core into a single unified structure, eliminating separate assembly steps and reducing manufacturing process complexity despite the advanced thick film printing technology used.
Data Source
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AI summary
A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.