Circuit Board Single Through Hole Conductive Channels
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Solution Overview
Problem
Conventional circuit boards require multiple through holes for conductive channels, leading to reduced layout area and flexibility, and limited density due to the need for separate holes for each channel connection.
Innovation Solution
A fabrication method that forms multiple conductive channels within a single through hole by patterning conductive and metal layers on a substrate with insulating layers, allowing for electrical isolation and connection between corresponding traces on different surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple through holes are used for conductive channels to connect different circuit layers, then electrical connection between layers is achieved, but layout area is reduced and layout flexibility is decreased
Solution Approach 1:
The patent merges multiple conductive channels into a single through hole structure. Instead of requiring separate through holes for each conductive channel, the invention allows multiple conductive channels to share one common through hole, thereby reducing the total number of through holes needed and increasing the available layout area.
Solution Approach 2:
The through hole structure is designed to serve multiple functions simultaneously. A single through hole accommodates multiple conductive channels, making the through hole a multi-functional element that performs both mechanical support and multiple electrical connection functions, thus improving layout flexibility and area utilization.
2Reliability
If multiple through holes are used for conductive channels, then electrical connection is established, but layout flexibility is reduced
Solution Approach 1:
By combining multiple conductive channels within a single through hole, the invention reduces the number of discrete elements that constrain layout design. This merging approach provides greater freedom in arranging circuit elements and routing traces, thereby enhancing layout flexibility.
Solution Approach 2:
The invention transitions from a planar arrangement of multiple through holes to a three-dimensional configuration where multiple conductive channels are stacked within a single vertical through hole. This dimensional change allows for more flexible two-dimensional layout design on the circuit board surface.
3Reliability
If separate through holes are used for each conductive channel, then electrical connection is achieved, but layout density cannot be improved
Solution Approach 1:
The patent applies merging by consolidating multiple conductive channels that would traditionally require separate through holes into a single shared through hole. This consolidation increases the effective density of conductive connections per unit area, as multiple electrical pathways are achieved within the space of one through hole.
Solution Approach 2:
The invention implements a nested structure where multiple conductive channels are positioned within the confines of a single through hole. This nesting arrangement allows for higher density of conductive connections by efficiently utilizing the vertical space within the through hole, thereby improving overall layout density.
Data Source
AI summary
A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.