Multilayer Wiring Board Electrode Thickness Optimization
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Solution Overview
Problem
Existing methods for manufacturing wiring boards with built-in electronic components face challenges such as crack formation and warping due to mismatched thicknesses between terminal electrodes and conductive patterns, leading to reliability issues and increased size, which affect integration and manufacturing efficiency.
Innovation Solution
A wiring board design where the thickness of the terminal electrodes is set to be less than the thickness of the conductive patterns, with via holes connecting them, and a manufacturing method that involves embedding electronic components in a substrate with insulation layers and forming taper-shaped via holes to ensure secure and reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of terminal electrodes is increased to match conductive patterns, then connection strength is improved, but crack formation and warping occur due to thickness mismatch
Solution Approach 1:
The invention changes the thickness parameter of terminal electrodes, making it less than the thickness of conductive patterns. This parameter modification eliminates the thickness mismatch that causes stress concentration, thereby preventing crack formation while maintaining adequate connection strength through the via hole structure.
2Reliability
If via holes are formed to connect electrodes and conductive patterns, then electrical connection is achieved, but warping occurs due to stress concentration
Solution Approach 1:
By modifying the thickness parameter of terminal electrodes to be less than the conductive pattern thickness, the invention reduces stress concentration at the via hole interface. This parameter change prevents warping of the wiring board while maintaining reliable electrical connection through the via holes.
3Productivity
If electronic components are embedded in substrate, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The invention applies preliminary action by pre-forming via holes in the substrate before embedding electronic components. This preliminary preparation simplifies the subsequent embedding process and reduces manufacturing complexity while achieving high integration density through effective component placement.
4Reliability
If conductor thickness is increased to ensure connection reliability, then connection strength is improved, but device size increases
Solution Approach 1:
The invention optimizes the thickness parameter of terminal electrodes, setting it to be less than the conductive pattern thickness. This parameter optimization achieves adequate connection reliability through the via hole connection while preventing excessive increase in device size, as the electrode thickness is controlled within appropriate limits.
Data Source
AI summary
A wiring board has a substrate, a conductive pattern formed over the substrate, and an electronic component mounted to the substrate and having an electrode. The electrode of the electronic component is connected to the conductive pattern through a via hole. The thickness of the electrode of the electronic component is made less than the thickness of the conductive pattern.