Embedded Ceramic Member Circuit Board Thermal Management
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Solution Overview
Problem
Conventional ceramic circuit boards waste ceramic material as high-heat-generating components only utilize part of the ceramic plate, leading to inefficient thermal management in high-heat-generating products.
Innovation Solution
A circuit board design featuring a multi-layer structure with a thru-hole and embedded ceramic member, where the ceramic member is securely connected using adhesive, reducing ceramic material usage and enhancing thermal efficiency by optimizing the ceramic material ratio and thermal expansion matching with electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional ceramic circuit board uses a large ceramic plate to ensure thermal efficiency, then thermal management is improved, but ceramic material waste increases
Solution Approach 1:
The patent divides the ceramic structure into a separate embedded ceramic member rather than using a large solid ceramic plate. The ceramic member is positioned only where heat generation occurs, segmenting the ceramic material usage to eliminate waste while maintaining thermal efficiency at the required location.
Solution Approach 2:
The patent applies ceramic material locally only in the region where high-heat-generating components are mounted, rather than using ceramic throughout the entire circuit board. This local quality approach ensures thermal management is improved where needed while minimizing ceramic material consumption.
2Loss of substance
If an embedded ceramic member is used to reduce material waste, then ceramic material usage is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates the ceramic member into the circuit board during the manufacturing process itself, rather than adding it as a separate post-manufacturing step. The ceramic member is embedded within the multi-layer board structure during lamination, which simplifies the overall manufacturing process despite the embedded configuration.
Solution Approach 2:
The patent nests the ceramic member within the multi-layer circuit board structure, integrating it into the existing manufacturing process. The ceramic member is positioned in a cavity formed during board fabrication, allowing it to be embedded without requiring separate complex assembly steps.
3Ease of manufacture
If adhesive is used to connect the ceramic member, then manufacturing flexibility is improved, but connection reliability may be affected
Solution Approach 1:
The patent uses adhesive as an intermediary material between the ceramic member and the circuit board substrate. This adhesive layer provides both manufacturing flexibility for positioning and bonding, while also accommodating thermal expansion differences between materials to maintain connection reliability under thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces ceramic material waste, improves thermal efficiency, and ensures better thermal management for high-heat-generating products by minimizing ceramic material usage and matching thermal expansion coefficients with electronic components.
Implementation Method 1
the adhesive is adhered on the lateral surface of the ceramic member to connect the ceramic member and the plates
Implementation Method 2
the first combining layer is connected to the ceramic body and the first conductive layer by chemical bonding
Data Source
AI summary
A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two opposite board surfaces thereof. The multi-layer structure includes a plurality of stacked plates and an adhesive connecting any two stacked plates. The ceramic member is arranged in the thru-hole of the multi-layer structure, and a surface of the ceramic member is approximately coplanar with a board surface of the multi-layer structure. The adhesive is adhered on the lateral surface of the ceramic member for connecting the ceramic member and the plates. The first conductive layer is formed on the board surface of the multi-layer structure and the surface of the ceramic member. Thus, the circuit board of the instant disclosure can be applied to a high-heat-generating product and is different from a conventional circuit board.