Non-Circular Aperture Electrical Interconnect for High-Density Contact
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Solution Overview
Problem
High-density electrical interconnects face challenges in achieving 100% electrical continuity without shorts or opens, requiring efficient assembly and satisfying geometrical constraints, which is difficult with small contact areas as interconnects become smaller and more complex.
Innovation Solution
The use of a standoff structure with an array of non-circular apertures in the adhesive layer, allowing for increased surface area contact between electrical contacts, enhancing the robustness and reliability of connections by aligning non-circular apertures with corresponding contact shapes, such as elliptical apertures with an aspect ratio of 1.5:1, to maximize usable surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If conventional circular apertures are used in the adhesive layer, then manufacturing is simpler and more conventional, but the usable surface area for electrical contact is insufficient
Solution Approach 1:
The patent applies asymmetry by changing the aperture shape from conventional circular to non-circular (elliptical, rectangular, or other polygonal) shapes that better match the geometry of electrical contacts. This asymmetric design maximizes the usable surface area for electrical contact while maintaining manufacturability through standard fabrication processes capable of producing non-circular features.
Solution Approach 2:
The patent changes the geometric parameters of the apertures by varying shape, aspect ratio, and dimensions to optimize the contact surface area. By adjusting these parameters, the design achieves up to 83% increase in usable surface area while remaining compatible with existing manufacturing capabilities.
2Volume of moving object
If interconnect density is increased to reduce size, then device footprint is reduced, but contact area per connection decreases
Solution Approach 1:
By using non-circular aperture shapes that conform to the contact geometry, the patent maximizes the utilization of available contact area at high densities. This allows smaller contact footprints while maintaining adequate contact surface area through optimized shape matching between apertures and contacts.
Solution Approach 2:
The patent applies local quality by tailoring the aperture shape and dimensions at each location to match the specific contact geometry. This localized optimization ensures maximum contact area utilization at each connection point, enabling high-density packaging without sacrificing connection quality.
3Reliability
If contact area is increased to improve connection robustness, then connection reliability improves, but device size increases
Solution Approach 1:
The non-circular aperture shapes are designed to match contact geometries, creating more efficient contact area utilization. This asymmetric optimization achieves robust connections with smaller overall device dimensions by eliminating wasted space in conventional circular aperture designs.
Data Source
AI summary
An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.