Multilayer Board Conductive Pattern Density for Through Hole Depth Control
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Solution Overview
Problem
The existing multilayer boards face challenges in reliably connecting electrode terminals of electronic components to conductive patterns due to variations in the depth of terminal-connecting through holes, which affect the reliability of the connection between the electronic component and the conductive patterns.
Innovation Solution
A multilayer board structure is developed with a stacked body of low-fluidity resin films and thermoplastic resin films, where the low-fluidity resin films with conductive patterns are alternately stacked, and the thermoplastic resin films are softened during hot pressing. The resin base film has terminal-connecting through holes, and the conductive patterns are arranged such that the number in the corresponding section is greater than in the non-corresponding section, reducing the likelihood of hole depth variation and improving connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive patterns are arranged in the multilayer board, then electrical connection function is provided, but flatness of resin films is reduced causing variation in through hole depth
Solution Approach 1:
The patent applies local quality by creating a conductive pattern only in the corresponding section where the through hole is located, rather than distributing conductive patterns throughout the entire resin film. This localized approach ensures that the resin film maintains flatness in non-corresponding sections while providing necessary electrical connection in the corresponding section, thereby resolving the contradiction between connection reliability and film flatness.
2Ease of manufacture
If thermoplastic resin films are used for hot pressing, then resin films are softened and bonded, but fluidity variation affects connection consistency
Solution Approach 1:
The patent applies parameter changes by selecting thermoplastic resin films with specific fluidity characteristics that are optimized for hot pressing. The resin film is designed to have appropriate softening behavior at hot pressing temperatures, allowing bonding while maintaining dimensional stability. This parameter optimization ensures consistent through hole depth and reliable connections, resolving the contradiction between ease of manufacture and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the connection between the electronic component and the conductive patterns by minimizing the depression of resin films during hot pressing, maintaining consistent through hole depth, and ensuring proper electrical contact.
Implementation Method 1
The thermoplastic resin films are softened when being heated to a predetermined temperature
Implementation Method 2
The resin base film and the stacked body are integrated with each other by hot pressing
Data Source
AI summary
In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.