Integrated Passive Devices on Low Resistivity Substrates
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Solution Overview
Problem
As integrated circuits decrease in size and increase in functionality, there is a challenge in enhancing the performance of integrated passive devices like inductors without increasing their footprint on the substrate, particularly in devices that communicate over wireless networks.
Innovation Solution
The solution involves creating integrated passive devices on low resistivity substrates with high resistivity materials, where conductive components are positioned on both surfaces of the substrate, connected through conductive pathways, and a cavity filled with high resistivity material to enhance performance without increasing the device footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated passive devices are designed to improve performance (increase inductance and Q factor), then device footprint increases, but available IC space is limited
Solution Approach 1:
The patent utilizes the third dimension by forming conductive pathways through the substrate thickness, connecting components on opposite surfaces. This vertical integration approach allows the inductor to achieve higher Q factor and inductance by utilizing substrate depth rather than expanding lateral footprint, directly resolving the contradiction between performance improvement and area consumption.
Solution Approach 2:
The patent employs composite material structures including high resistivity material regions embedded in the substrate, combined with conductive pathways and insulating layers. This composite approach creates optimized electromagnetic fields for inductor operation, achieving superior Q factor and inductance values within a compact footprint by leveraging the complementary properties of different materials.
2Reliability
If conventional single-surface device design is used, then manufacturing is simpler, but device performance (Q factor) is limited
Solution Approach 1:
The patent segments the inductor structure across two separate substrate surfaces, with first conductive components on one surface and second conductive components on the opposite surface. This segmentation allows each surface to be optimized independently for specific electrical functions, achieving higher Q factor through reduced parasitic effects while maintaining manageable manufacturing complexity through modular construction.
Solution Approach 2:
The patent introduces intermediate insulating layers and high resistivity material regions as mediators between the conductive components on opposite surfaces. These intermediary elements enable electrical isolation and field confinement, improving Q factor by reducing unwanted coupling and losses, while their standardized integration keeps manufacturing complexity within acceptable limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the Q factor and inductance of devices like inductors, enabling improved performance in wireless communication without occupying more space, and allows for integration with active devices and various applications.
Implementation Method 1
A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material
Implementation Method 2
One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component
Data Source
AI summary
The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first electrically-conductive device component disposed over a first surface. An intermediate electrically-insulating layer may be disposed between the electrically-conductive component and the low resistivity substrate. A second electrically-conductive component is disposed over the second surface of the low resistivity substrate. A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material. One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component to form a device. Exemplary devices include inductors, capacitors, antennas and active or passive devices incorporating such devices. Vertically integrated device systems can be formed using the device.