Impedance Matching PCB for Slab Lasers
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Solution Overview
Problem
Slab type gas lasers experience significant power loss and overheating due to impedance mismatch between the radio frequency power amplifier (RFPA) and electrodes, with existing impedance matching systems being costly, inefficient, and requiring additional cooling.
Innovation Solution
A system comprising a printed circuit board with conductive pads, a conductive plate, and adjustable inductor elements for impedance matching, which eliminates the need for separate capacitors and cooling systems by integrating heat dissipation and allowing for adjustable capacitance and inductance for optimal power transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional impedance matching systems are used with transformers, resistors, inductors, capacitors and transmission lines, then some power loss and overheating problems are prevented, but additional power loss occurs in transmission lines and expensive high voltage capacitors requiring additional cooling are needed
Solution Approach 1:
The patent combines the impedance matching function and heat dissipation function into a single integrated circuit board structure. The circuit board serves as both the impedance matching network (with trace inductors and capacitors) and the heat sink, eliminating the need for separate cooling systems and transmission lines. This merging reduces both energy loss and system complexity.
Solution Approach 2:
The circuit board performs multiple functions simultaneously: it provides impedance matching through its trace geometry, acts as a heat sink for thermal management, and serves as the structural support for the laser diode array. This multi-functionality eliminates the need for separate components and reduces overall system complexity.
2Reliability
If impedance matching systems are placed remotely from laser assemblies, then impedance matching is achieved, but transmission lines or cables are required which cause additional power loss and overheating
Solution Approach 1:
The patent transitions from a remote impedance matching approach to an integrated on-board approach. By embedding the impedance matching circuitry directly onto the circuit board that supports the laser diode array, the system eliminates the spatial separation that necessitates transmission lines. The impedance matching occurs at the source rather than at a distant location.
3Reliability
If high voltage capacitors are used in impedance matching systems, then impedance matching is achieved, but additional cost and cooling requirements are added
Solution Approach 1:
The patent changes the operating parameters by using low-voltage capacitors instead of high-voltage capacitors. The circuit board design and trace geometry are optimized to provide the necessary impedance matching at lower voltages, which eliminates the need for expensive high-voltage components and their associated cooling requirements.
Solution Approach 2:
The patent replaces expensive high-voltage capacitors with inexpensive low-voltage capacitors and uses the circuit board traces themselves as inductors. This substitution with cheaper components reduces manufacturing cost while maintaining the impedance matching function through clever circuit design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces energy loss, maximizes power transfer, and eliminates the need for cooling devices, enhancing the efficiency and cost-effectiveness of slab type gas lasers by integrating heat dissipation and impedance matching directly at the laser electrodes.
Implementation Method 1
The first inductor element has a first end and a second end. The first end of the first inductor is electrically connected to the connector, and the second end of the first inductor element is electrically connected to a first electrode or top slab of the slab laser
Implementation Method 2
The conductive plate is attached beneath the printed circuit board and has an opening corresponding to the aperture of the printed circuit board
Data Source
AI summary
A system transfers radio frequency energy from a radio frequency power amplifier (RFPA) to a slab laser. The system includes a connector, a printed circuit board, a conductive plate and a first inductor element. The connector is configured to receive a radio frequency power from the RFPA. The printed circuit board has at least one conductive pad etched on the printed circuit board. One of the conductive pads is electrically connected to the connector. The conductive plate is attached beneath the printed circuit board. The first inductor is electrically connected to the connector and electrically connected to a first electrode or top slab of the slab laser.